Gas chromatograph module with an electronic device

ABSTRACT

The present invention is directed to a gas chromatograph (GC) module having a column assembly and a printed circuit board mounted to a valve assembly. A plurality of electronic devices are mounted to the circuit board. The electronic devices include non-volatile memory, pressure sensors and detector devices.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. provisional patentapplication No. 60/713,986 filed on Sep. 2, 2005, which is herebyincorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

Chromatography is the separation of a mixture of compounds (solutes)into separate components. This separation permits the composition of allor part of the mixture to be determined. In gas chromatography, a gaschromatograph (commonly called a “GC”) is utilized to separate anddetermine the quantities of components of a gas mixture. A gaschromatograph performs these functions by taking a sample of the gasmixture to be analyzed and injecting it into a carrier gas stream, suchas helium or hydrogen, which then carries the gas sample through one ormore tubes (referred to as columns) that are packed with a very fineparticulate material. Each of the particles of this material are coatedwith a film from liquid that controls the rate at which the differentcomponents of the gas sample are absorbed and de-absorbed by theparticulate material. This rate of absorption and de-absorption alsovaries relative to each of the different components. Because of thisdiffering rate of absorption and de-absorption, certain gas moleculesrelated to one type or component of gas will exit the column morequickly than some of the other components will. This process ofseparation of components permits a detector located at the end of thecolumn to quantify the amount of a particular component that is presentin the mixture.

Gas chromatographs having a modular construction are known in the priorart. Examples of modular gas chromatographs are disclosed in U.S. Pat.No. 4,044,593 to Haruki et al.; U.S. Pat. No. 5,105,652 to Manfredi etal.; U.S. Pat. No. 5,340,543 to Annino et al.; and U.S. Pat. No.5,808,179 to Sittler et al. The modular gas chromatographs disclosed inthe foregoing references each have a module known as an analysis or GCmodule, which includes one or more columns for separating gascomponents. Some of these GC modules include detectors and moreparticularly, thermal conductivity detectors. None of these GC modules,however, include other electronic devices that can provide informationto a control unit controlling the gas chromatograph in which the GCmodule is mounted.

Based on the foregoing, there is a need in the art for a GC modulecontaining an electronic device other than a thermal conductivitydetector. The present invention is directed to such a GC module.

SUMMARY OF THE INVENTION

In accordance with the present invention, a gas chromatograph (GC)module is provided for mounting in a gas chromatograph assembly. The GCmodule includes a support structure and a separation device operable toseparate components of a gas. The separation device is mounted to thesupport structure. A circuit assembly is also mounted to the supportstructure and includes non-volatile memory for storing informationrelating to the operation of the gas chromatograph assembly with the GCmodule.

Also provided in accordance with the present invention is a GC modulefor mounting in a gas chromatograph assembly having a microprocessor.The GC module includes a support structure and a column assembly securedto the support structure. The column assembly has at least one columnfor separating components of a gas. The at least one column is woundinto a coil. A printed circuit board is mounted to the support structureand an electronic device is mounted to the printed circuit board. Theelectronic device is operable to provide information about the operationof the gas chromatograph with the GC module to the microprocessor. Theelectronic device is not a detector for detecting the components of thegas.

Another GC module provided in accordance with the present inventionincludes a circuit assembly that is mounted to a support structure andincludes a pressure sensor operable to measure the pressure of gasprovided to the GC module. A separation device operable to separatecomponents of the gas is also mounted to the support structure.

BRIEF DESCRIPTION OF THE DRAWINGS

The features, aspects, and advantages of the present invention willbecome better understood with regard to the following description,appended claims, and accompanying drawings where:

FIG. 1 shows a perspective view of a gas chromatograph with a portioncut away to better show the interior features thereof;

FIG. 2 shows a front perspective view of the gas chromatograph;

FIG. 3 shows a side view of a portion of a housing of the gaschromatograph;

FIG. 4 shows a sectional view of a portion of the gas chromatographshowing a main mount and a first communication boss with a connectorassembly mounted thereto;

FIG. 5 shows an exploded view of an antenna module of the gaschromatograph;

FIG. 6 shows a sectional view of a shield panel of the gaschromatograph;

FIG. 7 shows a side perspective view of a feed-through module of the gaschromatograph;

FIG. 8 shows a side perspective view of a connection structure of thefeed-through module;

FIG. 9 shows an end view of the feed-through module with a feed plate ofthe feed-through module removed;

FIG. 10 shows a perspective view of the feed-through module secured toan analytical module of the gas chromatograph;

FIG. 11 shows an exploded view of the analytical module;

FIG. 12 shows a perspective view of the analytical module with an ovenenclosure spaced above a column module;

FIG. 13 shows a bottom perspective view of a primary manifold plate ofthe gas chromatograph without electrical flow control devices mountedthereto;

FIG. 14 shows a top perspective view of the primary manifold plate withelectrical flow control devices mounted thereto;

FIG. 15 shows a top perspective view of a secondary manifold plate ofthe gas chromatograph;

FIG. 16 shows a top perspective view of a spacer and a heater platemounted to the secondary manifold plate;

FIG. 17 shows a perspective view of a valve assembly of a GC module ofthe gas chromatograph;

FIG. 18 shows a top plan view of a second valve plate of the valveassembly;

FIG. 19 shows a sectional view of the second valve plate taken alongline A-A in FIG. 18;

FIG. 20 shows a sectional view of the second valve plate taken alongline B-B in FIG. 18;

FIG. 21 shows a sectional view of the second valve plate taken alongline C-C in FIG. 18;

FIG. 22 shows a sectional view of the second valve plate taken alongline D-D in FIG. 18;

FIG. 23 shows a schematic diagram of a portion of a first GC valve ofthe valve assembly, wherein the first GC valve is in a backflush mode;

FIG. 24 shows a schematic diagram of a portion the first GC valve,wherein the first GC valve is in an inject mode;

FIG. 25 shows a perspective view of a column assembly of the GC module;

FIG. 26 shows a perspective view of a spool of the column assembly;

FIG. 27 shows a perspective view of the GC module;

FIG. 28 shows a top plan view of a detector plate of the valve assemblyof the GC module;

FIG. 29 shows a bottom plan view of a printed circuit board assemblymounted to the detector plate;

FIG. 30 shows a perspective view of an analytical processor assembly ofthe analytical module;

FIG. 31 shows a posterior end view of the gas chromatograph with a rearaccess cover removed from the housing to show an outer side of atermination assembly mounted inside the housing;

FIG. 32 shows an anterior end view of the gas chromatograph with a frontaccess cover removed from the housing and the analytical module removedfrom the inside of the housing to show an inner side of the terminationassembly mounted inside the housing;

FIG. 33 shows a schematic drawing of the gas chromatograph divided intoan RFI/EMI-protected compartment and an RFI/EMI-unprotected compartment;

FIG. 34 shows a schematic drawing of the interconnection of ananalytical processor printed circuit assembly, a main CPU, a terminationassembly and a display printed circuit assembly;

FIG. 35 shows a schematic drawing of the analytical processor printedcircuit assembly;

FIG. 36 shows a side elevational view of a main electronics assembly ofthe gas chromatograph;

FIG. 37 shows a front plan view of an outer side of the display printedcircuit assembly;

FIG. 38 shows windows of a graphical user interface (GUI) of the gaschromatograph;

FIG. 39 shows an NGC Menu window of the GUI;

FIG. 40 shows an Analyzer Control window of the GUI;

FIG. 41 shows a schematic diagram of the flow paths of sample gas andcarrier gas through the gas chromatograph when the valve assembly is ina “backflush mode”;

FIG. 42 shows a schematic diagram of the flow paths of sample gas andcarrier gas through the gas chromatograph when the valve assembly is inan “inject mode”;

FIG. 43 shows a schematic electrical diagram of a first reference TCDand a first sensor TCD connected to amplifier circuits;

FIG. 44 shows a side view of the connection structure of thefeed-through module with a portion cut away to provide a sectional view;

FIG. 45 shows an enlarged portion of the sectional view of theconnection structure identified by the circle “A” in FIG. 44; and

FIG. 46 shows an enlarged portion of the sectional view of theconnection structure identified by the circle “B” in FIG. 45.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

It should be noted that in the detailed description that follows,identical components have the same reference numerals, regardless ofwhether they are shown in different embodiments of the presentinvention. It should also be noted that in order to clearly andconcisely disclose the present invention, the drawings may notnecessarily be to scale and certain features of the invention may beshown in somewhat schematic form.

Below is a list of acronyms used in the specification and theirrespective meanings:

-   -   “CPU” shall mean “central processing unit”;    -   “DSP” shall mean “digital signal processor”;    -   “GC” shall mean “gas chromatograph”;    -   “MMU” shall mean “memory management unit”;    -   “PCA” shall mean “printed circuit assembly”;    -   “PCB” shall mean “printed circuit board”;    -   “RISC” shall mean “reduced instruction set computing”;    -   “TCD” shall mean “thermal conductivity sensor”; and    -   “USART” shall mean a “multi-channel universal serial        asynchronous receiver transmitter”.

As used herein, the term “printed circuit board” (or PCB) shall mean athin plate to which electronic components may be mounted and which hasconductive pathways or traces disposed on a non-conductive substrate.The term “printed circuit board” (or PCB) shall include circuit boardsthat are rigid and circuit boards that are flexible or slightlyflexible, i.e., flex circuits or rigid-flex circuits.

The present invention is directed to a gas chromatograph 10 having acompact and modular configuration, as well as improved operationalfeatures. The gas chromatograph 10 is adapted for mounting in the field,proximate to a source of gas that is desired to be analyzed, such asnatural gas. The gas chromatograph 10 is adapted for use in harsh andexplosive environments. More specifically, the gas chromatograph 10 isexplosion-proof and has a NEMA 4X rating. Referring now to FIG. 1, thegas chromatograph 10 generally comprises a housing 12 enclosing afeed-through module 14, an analytical module 16, a main electronicsassembly 18 having a main CPU 24, an analytical processor assembly 20and a termination assembly 21.

I. Housing

As used herein with regard to components of the housing 12, relativepositional terms such as “front”, “rear”, etc. refer to the position ofthe component in the context of the position of the gas chromatograph 10in FIG. 1. Such relative positional terms are used only to facilitatedescription and are not meant to be limiting.

Referring now also to FIGS. 2-4, the housing 12 includes a cylindricalmain section 22 having front and rear access openings closed byremovable front and rear access covers 28, 30, respectively. The mainsection 22 has a unitary construction and is comprised of a cast metal,such as aluminum or steel. The main section 22 has threaded front andrear collars 34, 36 that define the front and rear access openings,respectively. An interior surface of the main section 22 defines aninterior cavity 38. A plurality of mounting ears 40 are joined to theinterior surface of the main section 22, around the circumferencethereof and extend inwardly into the interior cavity 38. A main mount42, a feed boss 44, first and second communication bosses 46, 48 and oneor more conduit bosses 50 are joined to the main section 22 and extendoutwardly therefrom.

With particular reference now to FIG. 4, the main mount 42 iscylindrical and extends vertically downward from the bottom of thecentral portion of the main section 22. An interior surface of the mountdefines a cylindrical cavity 54 for receiving a pipe or other structurefor supporting the gas chromatograph. A grounding lug 56 is attached tothe exterior of the mount for electrical connection to a wire or cableelectrically connected to an earth ground. A threaded breather passageextends through the main section 22 and into the interior cavity 38 ofthe housing 12. A breather/drain valve 60 is threaded into the breatherpassage. In this manner, when the gas chromatograph 10 is mounted to apipe, the breather/drain valve 60 is disposed inside the pipe and, thus,is shielded from the outside environment.

The second communication boss 48 is cylindrical and extends upward froma top portion of the main section 22. An interior surface of the secondcommunication boss 48 helps defines an interior passage that extendsthrough the main section 22 and into the interior cavity 38 of thehousing 12. The interior surface has an interior thread that secures anantenna module 66 (shown in FIGS. 5 and 33) to the second communicationboss 48. The antenna module 66 is capable of transmitting and receivingradio frequency (RF) energy. Although the antenna module 66 is mountedoutside the housing 12, the antenna module 66 does not have a typical“aerial type” construction wherein the antenna extends into the air witha single electrically conducting element comprised of a flexible wire orrigid or semi-rigid metal conductor, commonly referred to as a whipantenna. Referring now to FIG. 5, the antenna module 66 includes an NPTplug 76 having a body with an exterior thread adapted to mate with theinterior thread of the second communication boss 48. An antenna 74secured to a plastic plate 72 is secured to the plug 76, such as by anover-molding process. The antenna 74 may be a microstrip antenna, aplanar inverted “F” antenna (PIFA), or a meander line antenna. Amicrostrip antenna is constructed using printed circuit boardfabrication techniques. One type of microstrip antenna is a patchantenna that comprises in stacked relation, a ground plane, a dielectricsubstrate and a metallic antenna element. A meanderline antenna is aslow wave structure that decouples the conventional relationship betweenthe antenna physical length and the resonant frequency based on thefree-space wavelength. A meanderline antenna typically includes a loopantenna and one or more frequency-tuning meander lines. A meander lineis a conductive path having a series of parallel elements forming aserpentine configuration. A typical meanderline antenna includes twovertical conductors extending from a ground plane and a horizontalconductor spaced above the ground plane and extending between thevertical conductors. The vertical conductors are connected to thehorizontal conductor by two meanderline couplers, respectively. Themeanderline couplers may have controllably adjustable lengths forchanging the characteristics of the antenna. Examples of meanderlineantennas which may be used for the antenna 74 are disclosed in U.S. Pat.Nos. 5,790,080 and 6,741,212, which are hereby incorporated byreference. A commercial example of a meanderline antenna, which may beused for the antenna 74 is a 5.8 GHz WLAN antenna available fromSkyCross. The antenna 74 is connected by a multilayer printed circuitboard 78 to a PCB mount RF connector 79, which is connected to thetermination assembly 21. A plastic cover 68 is secured to the plate 72over the antenna 74. The cover 68 may be filled with a potting compound70.

Referring back to FIG. 4, the first communication boss 46 is cylindricaland extends obliquely downward from a bottom portion of the main section22. An interior surface of the first communication boss 46 helps definesa passage that extends through the main section 22 and into the interiorcavity 38 of the housing 12. The interior surface has an interior threadfor securing a connector assembly 80 to the first communication boss 46.

The connector assembly 80 includes a connector 82, a cap 84 and a mount86. The connector 82 has a communication port 88 joined at an annularflange to a body with an exterior thread. The communication port 88 is aUniversal Serial Bus (USB) port. Alternately, the communication port 88may be an RS-232 or RS-485 port. The communication port 88 is connectedto the termination assembly 21 by wiring. The cap 84 is cylindrical andhas an annular flange disposed around a lower opening. An interiorsurface of the cap 84 includes an interior thread. The cap 84 may beconnected to the main mount 42 by a chain 90 to prevent misplacement ofthe cap 84 after removal. The mount 86 has an inner portion joined to anouter portion by an annular flange. The inner portion includes anexterior thread for mating with the interior thread of the firstcommunication port 46 so as to removably secure the mount 86 to thefirst communication port 46. The outer portion has an interior threadfor mating with the exterior thread of the connector 82 so as toremovably secure the connector 82 to the mount 86. In addition, theouter portion has an exterior thread for mating with the interior threadof the cap 84 so as to removably secure the cap 84 to the mount 86. Whenthe connector 82 is secured to the mount 86, the flange of the connector82 abuts an end surface of the outer portion of the mount 86, and whenthe cap 84 is secured to the mount 86, the connector 82 is disposedinside the cap 84 and the flange of the cap 84 abuts the annular flangeof the mount 86.

Referring back to FIG. 1, the rear access cover 30 is cylindrical andhas anterior and posterior ends. The anterior end has an interior threadfor mating with the exterior thread of the rear collar 36 so as toremovably secure the rear access cover 30 to the main section 22 andclose the rear access opening 26. The posterior end has a plurality ofspaced-apart and circumferentially disposed ribs. The ribs help anoperator establish a grip on the rear access cover 30 when rotating therear access cover 30 to open or close the rear access opening 26.

The front access cover 28 is cylindrical and has anterior and posteriorends. The posterior end has an interior thread for mating with theexterior thread of the front collar 34 so as to removably secure thefront access cover 28 to the main section 22 and close the front accessopening. The anterior end has a plurality of spaced-apart ribscircumferentially disposed around a view opening 94. The ribs help anoperator establish a grip on the front access cover 28 when rotating thefront access cover 28 to open or close the front access opening. Theview opening 94 is closed by a transparent shield panel 96 that providesshielding against radio frequency interference (RFI).

The conduit bosses 50 have threaded openings for securing conduits tothe housing 12. Interior passages extend through the conduit bosses 50and into the interior cavity 38. When the gas chromatograph 10 ismounted in the field, first and second conduits may be secured to firstand second conduit bosses 50, wherein the first conduit runs powerwiring into the interior cavity 38 and the second conduit runs acommunication line, such as an Ethernet cable, into the interior cavity38. If a conduit boss 50 is not connected to a conduit, the conduit boss50 is closed with an NPT plug.

When the gas chromatograph 10 is mounted and operating in the fieldunattended, the housing 12 is closed, i.e., the front and rear accesscovers 28, 30 are secured to the main section 22, the feed-throughmodule 14 is secured to the feed boss 44, the conduit bosses 50 areconnected to conduits or closed with NPT plugs, the second communicationboss 48 is connected to the antenna module 66 or closed with an NPTplug, and the first communication boss 46 is connected to the connectorassembly 80, with the cap 84 secured to the mount 86. When the housing12 is closed as described above, the housing 12 is explosion-proof (andflame-proof) and defines a single contained volume. As used herein, theterm “contained volume” shall mean that if an explosion occurs in thecontained volume, the explosion will not propagate to the environmentexternal to the contained volume. More specifically, if an explosionoccurs in the contained volume, gases escaping the contained volumethrough any gaps or openings in the housing 12 will not be hot enough toignite a classified hazardous location (or potentially explosiveatmosphere) external to the contained volume. Specifications forcertifying an enclosure as being explosion proof or flame proof areprovided by certifying agencies, such as the Factory Mutual ResearchCorporation (FM), the Canadian Standards Association (CSA), theInternational Electrotechnical Commission (IEC) and the Committee forElectrotechnical Standardization (CENELEC).

Referring now to FIG. 6, the shield panel 96 includes one or moretransparent sheets 100 adjoining one or more transparent conductivelayers 102. The transparent sheet 100 may be comprised of glass orplastic, and the layers 102 may be comprised of wire mesh and/orcoatings. For example, in one embodiment, the shield panel 96 maycomprise a wire mesh sandwiched between a pair of sheets of glass ortransparent plastic. The wire mesh is comprised of a metal such asstainless steel and may be coated with one or more layers of one or moreother metals, such as nickel, copper, silver, gold, aluminum, chrome, ortitanium, or alloys thereof. The wire mesh may have a wire diameterbetween about 0.0005 to about 0.010 inch and an open area (relative tothe total mesh area) between about 40% to about 75%. Examples of shieldpanels with wire mesh which may be used for the shield panel aredisclosed in U.S. Pat. Nos. 4,247,737; 4,826,718; and 5,012,041, all ofwhich are hereby incorporated by reference.

In other embodiments, the shield panel 96 comprises at least one sheetof glass or transparent plastic coated with at least one transparentconductive coating. Typically, each conductive coating has a thicknessin a range between about 5 and about 300 nm and may be comprised of asingle layer of a conductive metal, such as nickel, copper, silver,gold, aluminum, chrome, or titanium, or alloys thereof, or may becomprised of one or more layers of such a conductive metal along withone or more layers of a metal oxide, such as tin oxide, indium oxide,titanium oxide, zinc oxide, or bismuth oxide. The conductive metal layermay be directly deposited on the glass or plastic sheet and overlaidwith an oxide layer, or the conductive metal layer may be sandwichedbetween a pair of metal oxide layers. In one embodiment, a pair ofconductive metal coatings are formed on opposing major surfaces of asingle sheet of glass. In another embodiment, one such conductive metalcoating is deposited on a major surface of a first glass sheet and asemiconductive coating of a metal oxide, such as tin doped indium oxide(ITO) or doped tin oxide is deposited on a major surface of a secondglass sheet, wherein the conductive metal coating is positioned betweenthe two glass sheets and the semiconductive coating is positioned on theexterior of the shield panel. A conductive metal layer is typicallydeposited on a glass or plastic sheet by sputtering in an inert gas,such as argon, while a metal oxide layer is typically deposited on aglass or plastic sheet by reactive sputtering in an atmospherecontaining an inert gas and a controlled amount of oxygen. Examples ofshield panels with a conductive coating which may be used for the shieldpanel 96 are disclosed in U.S. Pat. Nos. 4,978,812; 5,147,694; and5,358,787, all of which are hereby incorporated by reference.

As measured in decibels (dB) of attenuation, some embodiments of theshield panel 96 provide at least 30 dB of attenuation for frequencies ina range between 1 and 10,000 MHz. In other embodiments, the shield panel96 provides at least 40 dB of attenuation for frequencies in a rangebetween 1 and 10,000 MHz. In smaller frequency ranges, such as in arange between 1 and 1,000 MHz, some embodiments of the shield panel 96provide at least 50 dB of attenuation. At a frequency of about 1,000MHz, some embodiments of the shield panel 96 provide more than 60 dB ofattenuation. It should be noted that 40 dB corresponds to an attenuationof about 99% and 60 dB corresponds to an attenuation of about 99.9%.

Although the shield panel 96 substantially blocks the transmission ofelectromagnetic waves having lower frequencies and longer wavelengths(such as radio, television and cell phone signals), the shield panel 96substantially permits the transmission of electromagnetic waves havinghigher frequencies and shorter wavelengths (such as visible and nearinfrared light waves). Thus, the shield panel 96 has a visible lighttransmission of at least 50%. Some embodiments of the shield panel 96have a visible light transmission of at least 60% and still otherembodiments of the shield panel 96 have a visible light transmission ofat least 70%.

In order to provide a direct electrical connection between the shieldpanel 96 and the housing 12, a conductive gasket 104 may be disposedaround the view opening 94, between the shield panel 96 and the frontaccess cover 28. The gasket 104 is compressible and may be comprised ofmetal-loaded rubber. The shield panel 96 may be held in place andcompressed against the gasket 104 by clasps, or other types offasteners.

II. Feed-Through Module

Referring now to FIGS. 1, 3 and 7-10, the feed-through module 14 isremovably secured to the feed boss 44 of the housing 12 by a threadedconnection. When so secured, the longitudinal axis of the feed-throughmodule 14 is disposed perpendicular to the longitudinal axes of thehousing 12 and the analytical module 16. The feed-through module 14generally comprises a connection structure 110 and a feed plate 112. Thefeed plate 112 is removably secured to the connection structure 110.

The connection structure 110 is composed of a metal, such as aluminum,and includes a body 114 joined between a base 116 and a head 118. Thebase 116 is generally rectangular and has a first major face 120 with anenlarged groove 122 formed therein and an opposing second major face124. An enlarged threaded bore 126 extends through the second major face124 into the base 116. A plurality of inner passage openings 128 areformed in the second major face 124 and are circumferentially disposedaround the bore 126. An annular gasket 123 is secured to the secondmajor face 124 and has holes formed therein, which are aligned with theinner passage openings 128. A pair of guide posts 130 are secured to thebase 116 on opposing sides of the bore 126 and extend outwardly from thesecond major face 124, through the gasket. The body 114 has acylindrical portion with an exterior thread for mating with the interiorthread of the feed boss 44 so as to secure the feed-through module 14 tothe housing 12. A shoulder is disposed proximate to an outermost turn ofthe exterior thread and is provided with an O-ring 134 for forming aseal between the feed boss 44 and the feed-through module 14. Aplurality of threaded mounting openings 136 are disposed around thecircumference of the head 118.

Referring now to FIGS. 44, 45 and 46, a plurality of flow chambers 570are formed in the connection structure 110 and are disposed in acircular configuration. Each flow chamber 570 comprises an inner opening571, an outer opening 572 and a middle portion defined by a helicalthread 574 formed in the connection structure 110. The outer openings572 are formed in an outer surface of the head 118, radially inward fromthe mounting openings 136. The minor thread diameter 574 b of thehelical thread 574 is flattened. A solid metal insert 576 is disposed ineach flow chamber 570. Each insert 576 comprises an inner portion havinga smooth exterior surface and an outer portion having an exteriorsurface with a helical thread 578 formed therein. The major threaddiameter 578 a of each helical thread 578 is flattened. In the innerportion of each insert 576, a longitudinal passage 580 extends throughan inner end of the insert 576 and intersects an inner transversepassage 582 extending through the insert 576. The longitudinal passages580 are connected to flow paths 583 extending through the connectionstructure 110 to the inner passage openings 128 in the base 116. In thehelical portion of each insert 576, the helical thread 578 isinterrupted by a band of smooth exterior surface. An outer transversepassage 584 extends through each insert 576 in the band of smoothexterior surface. In each insert 576, a longitudinal passage 585intersects the outer transverse passage 584 and opens into an enlargedbore 586 formed in an outer end of the insert 576. The outer end of eachinsert 576 is recessed into its corresponding flow chamber 570 so as toform an interior annular ledge proximate to the outer opening 572.

In each flow chamber 570 and insert 576 combination, the flattened minorthread diameter 574 b of the connection structure 110 cooperates withthe minor thread diameter 578 b of the insert 576 to form an inner flowpassage 588, while the major thread diameter 574 a of the connectionstructure 110 cooperates with the flattened major thread diameter 578 aof the insert 576 to define an outer flow passage 590. The outer flowpassage 590 is disposed radially outward from the inner flow passage588. Both the outer flow passage 590 and the inner flow passage 588extend between and are connected to the inner and outer transversepassages 582, 584. Thus, for each flow chamber 570 and insert 576combination, a sample gas stream from a flow path 583 enters thelongitudinal passage 580, travels to the inner transverse passage 582and splits into two streams that travel through the inner and outer flowpassages 588, 590 respectively. The two streams recombine in the outertransverse passage 584, travel through the longitudinal passage 585 tothe enlarged bore 586 and exit the flow chamber 570 through the outeropening 572. Of course, vented gas entering an outer opening 572 travelsthe same path, but in the opposite direction.

It should be appreciated that each flow chamber 570 and insert 576combination provides two flame paths, namely the inner and outer flowpassages 588, 590. These two flame paths provide twice thecross-sectional area of a conventional flame path, i.e., a 10 mil IDtube. In addition, the two flame paths provide a significantly largerflow surface area than a conventional flame path. This increased surfacearea results in greater cooling of escaping gases (in the event of aninternal explosion), thereby providing a wider safety margin on flamesuppression.

The outer openings 572 of the flow chambers 570 are located in adisc-shaped depression 594 formed in the head 118. A single disc-shapedgasket 144 (shown in FIG. 9) is secured in the depression 594 and hasopenings aligned with the outer openings 572. Disc-shaped filters 146(shown in FIG. 9) are disposed in those outer openings 572 that functionas sample gas inputs. Those outer openings 572 that function as ventoutputs are not provided with filters. The filters 146 are supported onthe ledges formed by the outer ends of the inserts 576. The filters 146may be secured in place by the gasket 144. The filters 146 are comprisedof sintered stainless steel with 0.5 to 10 micron openings.

The feed plate 112 is composed of a metal, such as stainless steel, andis cylindrical, with inner and outer end surfaces. A plurality ofthreaded mounting openings 138 are circumferentially disposed around thefeed plate 112 and extend therethrough. A plurality of threaded openings140 (shown in FIG. 3) extend through the feed plate 112 at obliqueangles to the central axis of the feed plate 112. The openings 140 arearranged in a circular configuration and are disposed radially inwardfrom the mounting openings 138. For each opening 140, an indeliblemarking identifying the opening is made in the outer end surface,proximate to the opening 140. By way of example, the openings 140 a maybe sample inputs 1-4 marked S1, S2, S3, S4, respectively, and a carriergas input marked CAR; and the openings 140 b may be column vents 1, 2,marked CV1, CV2, respectively, a sample vent marked SOV, and a gaugeport vent marked GPV. The markings may be made by photo,electrochemical, or laser etching. Fitting assemblies 142 are secured inthe openings 140, respectively, for connecting tubes to the openings140, respectively. Each fitting assembly 142 may be a compressionfitting comprising a male nut and a ferrule. The male nuts arethreadably secured in the openings 140 and extend outwardly therefrom,while the ferrules are disposed in the openings 140 and are compressedby the male nuts. The ends of the tubes extend through the male nuts andthe ferrules and are held in place in the openings 140 by thecompression of the ferrules. Since the openings 140 are disposed atoblique angles, the fitting assemblies 142 extend obliquely outward fromthe feed plate 112, which provides more space for accessing the fittingassemblies 142 manually or with tools.

The mounting openings 138 in the feed plate 112 align with the openings136 in the head 118 so that the feed plate 112 can be secured to theconnection structure 110 by threadably disposing screws 148 in thealigned mounting openings 136, 138. When the feed plate 112 is securedto the connection structure 110, the openings 140 align with the outeropenings 572 in the connection structure 110, respectively, therebyforming inlet paths and vent paths that extend through the feed-throughmodule 14 between the inner passage openings 128 in the base 116 and theopenings 140 in the feed plate 112. More specifically, the inlet pathsinclude sample stream paths 1-4 and a carrier gas path, and the ventpaths include a sample vent path and a gauge port vent path. The gasket144 seals the interface between the feed plate 112 and the connectionstructure 110 around the openings 140.

The feed-through module 14 includes an inlet heating assembly comprisinga cartridge heater 150, a temperature sensor 152 and a thermal switch orbreaker 154. The cartridge heater 150 is secured within a tunnel thatextends longitudinally into the body 114 of the connection structure 110and has an opening disposed proximate to the groove 122 of the base 116.The temperature sensor 152 is disposed in a well formed in the body 114of the connection structure 110, proximate to the cartridge heater 150.The thermal breaker 154 is secured within the groove 122 of the base116. The inlet heating assembly is connected to an analytical PCA 160 ofthe analytical processor assembly 20. The analytical PCA 160 controlsthe operation of the cartridge heater 150 based on the temperaturesensed by the temperature sensor 152. If the temperature of the base 116exceeds a maximum temperature, the thermal breaker 154 opens and cutsoff power to the cartridge heater 150. When the temperature of the base116 decreases to a lower reset temperature, the thermal breaker 154automatically closes and provides power to the cartridge heater 150.

The construction of the feed-through module 14 provides a number ofbenefits. The provision of a separate removable feed plate 112 permitsthe gas chromatograph 10 to utilize different sample interfaces. Morespecifically, the feed plate 112 can be removed and replaced withanother type of feed plate that may be more appropriate or desired for aparticular installation of the gas chromatograph 10. For example, if itis desired to use vent tubes and inlet tubes with O-ring connections, afirst alternate feed plate (not shown) with O-ring fittings may be usedin lieu of the feed plate 112. Also, if a sample conditioning system isdesired and is not provided, a second alternate feed plate with a sampleconditioning system mounted thereto may be used in lieu of the feedplate 112 (or the first alternate feed plate). The removal of the feedplate 112 and replacement with the first alternate feed plate or thesecond alternate feed plate can be performed in a quick and simplemanner without disconnecting the entire feed-through module 14 from theanalytical module 16 or removing it from the housing 12. The exchange isperformed by simply unscrewing the screws 148, swapping the feed platesand then re-threading the screws 148.

It should be appreciated that in lieu of securing the feed plate 112 tothe connection structure 110 by the screws 148 as shown and described,the feed plate 112 may be secured to the connection structure 110 by afloating connection or a stab connection.

As used herein with regard to components of the analytical module 16,the main electronics assembly 18, the analytical processor assembly 20and the termination assembly 21, relative positional terms such as“top”, “bottom”, etc. refer to the position of the component in thecontext of the position of the analytical module 16 in FIG. 12. Suchrelative positional terms are used only to facilitate description andare not meant to be limiting.

III. Analytical Module

Referring now to FIGS. 11 and 12, the analytical module 16 generallycomprises a manifold module 162, a gas chromatograph (GC) module 164, anoven enclosure 166, a dewar 356 and an analytical processor assembly 20.

Manifold Module

The manifold module 162 generally includes a primary manifold plate 170,a secondary manifold plate 172, a spacer 174 and a heater plate 176.

Referring now to FIGS. 13, 14 and 15, the primary and secondary manifoldplates 170, 172 are each composed of a metal, such as aluminum. A gasket192 is disposed between the primary and secondary manifold plates 170,172. The primary manifold plate 170 includes a tongue 178 with a majorface 178 a that is adapted to interface with the second major face 124of the base 116 in the feed-through module 14. An enlarged main mountinghole 196 extends through the tongue 178. A pair of guide holes 179 and aplurality of fluid openings 181 are formed in the major face 178 a andare disposed around the main mounting hole 196. When the primarymanifold plate 170 is secured to the feed-through module 14, the fluidopenings 181 are connected to the inner passage openings 128 in thefeed-through module 14 for fluid flow therebetween. A plurality ofinternal fluid passages is formed in the primary manifold plate 170 soas to form a first internal passage network, which is connected to thefluid openings 181.

An enlarged, countersunk main mounting hole 198 is formed in thesecondary manifold plate 172 and is aligned with the main mounting hole196 in the primary manifold plate 170. The main mounting holes 196, 198are used to mount the analytical module 16 to the feed-through module14, as will be discussed further below. A central mounting hole 200extends through the secondary manifold 172 and is disposed along thecentral axis thereof. A plurality of threaded mounting holes 202 areformed in the primary manifold plate, and a plurality of correspondingmounting holes 204 are formed in the secondary manifold plate 172. Theprimary manifold plate 170 is secured to the secondary manifold plate172 by screws 206 that extend through the mounting holes 204 in thesecondary manifold plate 172 and are threadably received in the holes202 in the primary manifold plate 170. A plurality of internal fluidpassages is formed in the secondary manifold plate 172 so as to form asecond internal passage network. When the primary and secondary manifoldplates 170, 172 are secured together, the first internal passage networkof the primary manifold plate 170 is connected to the second internalpassage network of the secondary manifold plate 172 for fluid flowtherebetween.

Electrical flow control devices 210 are secured to the primary manifoldplate 170 and are connected into the first internal passage network tocontrol the flow of carrier gas (such as helium) and sample gas (such asnatural gas) to the GC module 164 and, more particularly, to the valveassembly 180. The flow control devices 210 include sample valves 212, ashut-off valve 214, a pilot valve 216 and first and second pressureregulator valves 218, 220. The flow control devices 210 are electricallyconnected to and controlled by the analytical PCA 160 of the analyticalprocessor assembly 20. The sample valves 212 are three-way, normallyclosed, solenoid-actuated valves that selectively control the flow ofsample gas from the sample inlet paths to the first and second GC valves188, 190. The shut-off valve 214 is a three-way, normally open,solenoid-actuated valve that controls the flow of gas from the samplevalves 212 to the first and second GC valves 188, 190. The pilot valve216 is a four way, magnetically latching solenoid actuated valve thatpneumatically controls the actuation of the first and second GC valves188, 190. The first and second pressure regulators 218, 220 areproportional solenoid valves for controlling the pressure of the carriergas supplied to the first and second GC valves 188, 190. Actuation ofone of the sample valves 212 will cause gas from the sample lineassociated with the actuated sample valve 212 to be supplied to thefirst and second GC valves 188, 190, assuming the shut-off valve 214 isopen.

Referring now to FIG. 16, the spacer 174 is composed of an insulatingmaterial, such as an insulating plastic or ceramic. In one embodiment,the spacer 174 is composed of chlorinated polyvinyl chloride (CPVC),which has good insulating properties and is heat and chemical resistant.The spacer 174 includes a cylindrical body with an annular flangedisposed at an upper end thereof. A countersunk bore extends through thespacer 174 along the center axis thereof. A plurality of mounting holeswith threaded inserts (or threaded holes) extend through the spacer 174and are disposed around the countersunk bore. The spacer 174 is securedto the secondary manifold plate 172 by a single threaded bolt with asocket head, which extends through the countersunk bore, the centralmounting hole 200 in the secondary manifold 172 and into a threaded borein the primary manifold plate 170. The spacer 174 spaces the heaterplate 176 above the secondary manifold plate 172 and limits thermalcommunication between the heater plate 176 and the secondary manifoldplate 172. Internal flow passages for sample gas, carrier gas, vent gas,etc. extend through the spacer 174 and form a third internal passagenetwork, which is connected to the second internal passage network ofthe secondary manifold plate 172.

The heater plate 176 is composed of aluminum or other conductive metaland comprises a generally cylindrical pillar 226 joined to a generallycylindrical pedestal 228 with an annular flange 230. A plurality ofmounting holes are disposed around the pedestal 228 and extendlongitudinally therethrough. A pair of bearings 232 are mounted insockets formed in diametrically opposite portions of a side surface ofthe pedestal 228. A cartridge heater 234 is mounted in a tunnel thatextends through the side surface of the pedestal 228. The cartridgeheater 234 is electrically connected to and controlled by the analyticalPCA 160 in the analytical processor assembly 20. An enlargedlongitudinally-extending channel 236 is formed in the pedestal 228 andextends through the flange 230. The channel 236 accommodates a ribboncable 237 (shown schematically in FIG. 34) that connects the GC PCBA 184to the analytical processor assembly 20. An oven temperature sensor 238(shown in FIG. 12 and schematically in FIG. 35) is mounted in a wellthat is formed in the pedestal 228 and is located in the channel 236. Athreaded central bore 240 is formed in the pillar 226 of the heaterplate 176 and extends along the center axis thereof. Outward from thecentral bore 240, a pair of sample conduits are formed in the pillar 226and extend longitudinally therein. Each of the sample conduits includesa narrow inlet portion and an enlarged main portion, which is defined bya helically threaded interior wall. Cylindrical inserts 242 (shown inFIG. 16) composed of metal are disposed in the main portions of thesample conduits. In each sample conduit, the threaded interior wallcooperates with the insert to define a helical sample passage 244 thatextends through the heater plate 176. The helical sample passages 244are connected in series by a sample pressure sensor 246 in the valveassembly 180, as is schematically shown in FIGS. 41 and 42. Theinterconnected helical sample passages 244 increase the residence timeof the sample gas in the heater plate 176, thereby improving the heatingof the sample gas. An irregular gasket 248 is secured by pins to anupper end surface of the pillar 226. The heater plate 176 is secured tothe spacer 174 by screws 250 that extend through the mounting holes inthe heater plate 176 and are threadably received in the inserts in themounting holes in the spacer 174. The helical sample passages 244 alongwith other internal flow passages for carrier gas, vent gas, etc. extendthrough the heater plate 176 and form a fourth internal passage network,which is connected to the third internal passage network of the spacer174.

A cap 358 for engagement with the dewar 356 is secured to the secondarymanifold plate 172. The cap 358 is composed of plastic and includes acylindrical outer side wall 360 joined at a rounded edge to an annularend wall 362. An interior surface of the outer side wall 360 isthreaded. A central portion of the end wall 362 has a recessed exteriorsurface and a plurality of holes extending therethrough. A cylindricalinterior wall 364 is joined to an interior surface of the end wall 362and extends upwardly therefrom. A metal clamp ring 366 with a pluralityof holes formed therein is disposed radially inward from the interiorwall 364 and adjoins an interior surface of the central portion of theend wall 362. Screws 368 extend through the holes in the clamp ring 366and the cap 358 and are received in threaded openings in the secondarymanifold plate 172, thereby securing the clamp ring 366 and, thus, thecap 358 to the secondary manifold plate 172.

GC Module

The GC module 164 generally comprises a valve assembly 180, a columnassembly 182, a GC PCBA 184 and a cover plate 186. FIG. 27 shows the GCmodule 164 fully assembled.

A plurality of internal flow passages for sample gas, carrier gas, ventgas, etc. extend through the valve assembly 180 and form a fifthinternal passage network, which is connected to the fourth internalpassage network of the heater plate 176. The fifth internal passagenetwork comprises first and second GC valves 188, 190.

Referring now to FIG. 17, the valve assembly 180 includes a first valveplate 252, a second valve plate 254, a third valve plate 256 and adetector plate 258. The first valve plate 252 has a cylindrical sidesurface and upper and lower end surfaces. A first diaphragm 260 isdisposed between the upper end surface of the first valve plate 252 anda lower end surface of the second valve plate 254, while a seconddiaphragm 262 is disposed between an upper end surface of the secondvalve plate 254 and a lower end surface of the third valve plate 256. Agasket 264 is disposed between an upper end surface of the third valveplate 256 and a lower end surface of the detector plate 258. The firstvalve plate 252, the second and third valve plates 254, 256 and thedetector plate 258 are coaxially disposed and are secured together by aplurality of screws 266 that extend through the cover plate 186, the GCPCBA 184, the detector plate 258 and the second and third valve plates254, 256 and are threadably received in openings in the first valveplate 252. The first valve plate 252 and the second and third valveplates 254, 256 have substantially the same diameters so as to form amandrel 268 for the column assembly 182. The mandrel 268 has asubstantially smaller diameter than the detector plate 258. In thismanner, when the column assembly 182 is mounted to the mandrel 268, thecolumn assembly 182 abuts against an annular portion of the lower endsurface of the detector plate 258, which is disposed radially outwardfrom the mandrel 268. The valve assembly 180 is secured to the heaterplate 176 by an elongated bolt 270 that extends through the center ofthe cover plate 186, the GC PCBA 184 and the valve assembly 180 and isthreadably received in the central bore 240 of the heater plate 176.

An upper end surface of the first valve plate 252, the first diaphragm260 and a lower end surface of the second valve plate 254 cooperate todefine the first GC valve 188 (shown schematically in FIGS. 41 and 42),while an upper end surface of the second valve plate 254, the seconddiaphragm 262 and a lower end surface of the third valve plate 256cooperate to define the second GC valve 190 (shown schematically inFIGS. 41 and 42). Each of the GC valves 188, 190 have ports 1-10 (seeFIGS. 41 and 42). The ports 1-10 of the first GC valve 188 are formed inthe first valve plate 252, while the ports 1-10 of the second GC valve190 are formed in the third valve plate 256. The first and second GCvalves 188, 190 each have two modes, namely an “inject” mode and a“backflush” mode.

Referring now to FIGS. 18-22, the second valve plate 254 is cylindricaland includes the upper and lower end surfaces, respectively. A centralbore 271 extends through the valve plate 254, along the central axisthereof. Radially outward from the central bore 271, an annular uppermanifold groove 272 is formed in the upper end surface 254 a and anannular lower manifold groove 273 is formed in the lower end surface 254b. The upper manifold groove 272 is connected to an internal firstcarrier gas passage 267, while the lower manifold groove 273 isconnected to an internal second carrier gas passage 269. The first andsecond carrier gas passages are connected to the pilot valve 216 forreceiving carrier gas therefrom. The pilot valve 216 only providescarrier gas to one of the first and second carrier gas passage and,thus, one of the upper and lower manifold grooves 272, 273, at a time.When the upper manifold groove 272, but not the lower manifold groove273, is provided with carrier gas, the first and second GC valves 188,190 are in the “backflush” mode. Conversely, when the lower manifoldgroove 273, but not the upper manifold groove 272, is provided withcarrier gas, the first and second GC valves 188, 190 are in the “inject”mode.

A substantially circular pattern of elliptical upper depressions 274 areformed in the upper end surface of the second valve plate 254, aroundthe upper manifold groove 272, and a circular pattern of ellipticallower depressions 275 are formed in the lower end surface of the secondvalve plate 254, around the lower manifold groove 273. The upper andlower depressions 274, 275 are aligned with each other, respectively. Afirst series of alternate upper depressions 274 a are connected to theupper manifold groove 272, while a second series of alternate upperdepressions 274 b are connected to the lower manifold groove 273,wherein the upper depressions 274 a in the first series are separated bythe upper depressions 274 b in the second series and vice versa.Similarly, a first series of alternate lower depressions 275 a areconnected to the upper manifold groove 272, while a second series ofalternate lower depressions 275 b are connected to the lower manifoldgroove 273, wherein the lower depressions 275 a in the first series areseparated by the lower depressions 275 b in the second series and viceversa. The first series of upper depressions 274 a and the first seriesof lower depressions 275 a are aligned and connected by internal firstbores 276, respectively, while the second series of upper depressions274 b and the second series of lower depressions 275 b are aligned andconnected by internal second bores 277. The first bores 276 areconnected to the upper manifold groove 272 by internal first passages412, while the second bores 277 are connected to the lower manifoldgroove 273 by internal second passages 414.

As a result of the construction described above, when carrier gas issupplied to the upper manifold groove 272, carrier gas is provided tothe first series of upper depressions 274 a and to the first series oflower depressions 275 a; and when carrier gas is supplied to the lowermanifold, carrier gas is provided to the second series of upperdepressions 274 b and the second series of lower depressions 275 b. Inother words, when the first and second GC valves 188, 190 are in the“backflush” mode, carrier gas is provided to the first series of upperdepressions 274 a and to the first series of lower depressions 275 a;and when the first and second GC valves 188, 190 are in the “inject”mode, carrier gas is provided to the second series of upper depressions274 b and the second series of lower depressions 275 b.

Referring now to FIGS. 23 and 24, the construction and operations of theports 1-10 of the first GC valve 188 will be described. The constructionand operation of the ports 1-10 of the second GC valve 190 will not bedescribed, it being understood that the ports 1-10 of the second GCvalve 190 have substantially the same construction and operation as theports of the first GC valve 188, except for being formed in the lowerend surface of the third valve plate 256. Each port of the first GCvalve 188 comprises a pair of connector passages 416, 418 formed in thefirst valve plate 252 and arranged in a V-shaped configuration. Upperends of the connector passages 416, 418 have openings 424, 426 formed inthe upper end surface 252 a, respectively. Lower ends of the connectorpassages 416, 418 are connected together at a junction point, which isconnected to an inlet/outlet line 420. The openings 424, 426 aredisposed at the same radial distance from the center of the first valveplate 252. The opening 426 of a port and the opening 424 of an adjacentport are aligned with a lower depression 275 a, while the other opening424 of the port and the opening 426 of the other adjacent port arealigned with an adjacent lower depression 275 b. Thus, with regard toports 6 and 5, the opening 426 of port 6 and the opening 424 of port 5are both aligned with a lower depression 275 b, while the opening 426 ofport 5 and the opening 424 of port 4 are both aligned with an adjacentlower depression 275 a.

The first diaphragm 260 overlays the opening 426 of port 6 and theopening 424 of port 5. When carrier gas is not supplied to the lowermanifold groove 273 and thus does not enter the lower depression 275 bthat is aligned with the opening 426 of port 6 and the opening 424 ofport 5, gas from the inlet/outlet line 420 of port 5 exits the opening424 of port 5 and deflects the first diaphragm 260 into the lowerdepression 275 b (as shown in FIG. 23), thereby forming a travel paththrough which the gas travels to the opening 426 of port 6. In thismanner, port 5 is connected to port 6, as is shown in FIG. 41. Whencarrier gas is supplied to the lower manifold groove 273 and enters thelower depression 275 b, the carrier gas presses the first diaphragm 260against the opening 424 of port 5 and the opening 426 of port 6 (asshown in FIG. 24), thereby preventing gas from the outer opening 424 ofport 5 from traveling to the opening 426 of port 6. In this manner, theport 5 is disconnected from port 6, as is shown in FIG. 42.

As can be appreciated from the foregoing description, each depression274, 275 is operable to disconnect or connect aligned ports of itscorresponding GC valve 188, 190 based on the presence or absence ofcarrier gas in the depression 274. As set forth above, the supply ofcarrier gas to the depressions 274, 275 is determined by the supply ofcarrier gas to the upper and lower manifold grooves and, thus the modeof the first and second GC valves 188, 190. Thus, when the first andsecond GC valves 188, 190 are in the “backflush” mode, carrier gas isprovided to the first series of upper depressions 274 a and to the firstseries of lower depressions 275 a, which connects the port pairs of 1&2,3&4, 5&6, 7&8, and 9&10 of the first and second GC valves 188, 190 anddisconnects the port pairs of 2&3, 4&5, 6&7, 8&9, and 10&1 of the firstand second GC valves 188, 190, as is shown in FIG. 41. When the firstand second GC valves 188, 190 are in the “inject” mode, carrier gas isprovided to the second series of upper depressions 274 b and the secondseries of lower depressions 275 b, which connects the port pairs of 2&3,4&5, 6&7, 8&9, and 10&1 of the first and second GC valves 188, 190 anddisconnects the port pairs of 1&2, 3&4, 5&6, 7&8, and 9&10 of the firstand second GC valves 188, 190, as is shown in FIG. 42.

As shown in FIG. 25, the column assembly 182 generally includes a spool278, first preliminary column 280, first column 282, a secondpreliminary column 284, a second column 286 and first and second sampleloops 288, 290.

Referring now to FIG. 26, the spool 278 includes a hollow cylindricalbody 294 with open upper and lower ends and an annular flange 296disposed around the upper end. A plurality of flow openings 297 areformed on a top side of the flange 296. A gasket 298 is secured by pinsto the top side of the annular flange 296. The gasket 298 has openingsaligned with the flow openings 297 in the flange 296. On a bottom sideof the flange 296, a plurality of threaded openings 300 are disposedaround the flange 296. The flange 296 has a plurality of internalpassages that connect the flow openings 297 to the openings 300. Theseinternal passages form a sixth internal passage network. Ends of thecolumns and sample loops 280-290 are connected to fitting assemblies 302threadably secured in the openings 300, respectively. Each fittingassembly 302 may be a compression fitting comprising a male nut 304 anda ferrule 306. The male nuts 304 are threadably secured in the openings300 and extend outwardly therefrom, while the ferrules 306 are disposedin the openings 300 and are compressed by the male nuts 304. The ends ofthe columns and sample loops 280-290 extend through the male nuts 304and the ferrules 306 and are held in place in the openings 300 by thecompression of the ferrules 306. Disc-shaped filters 308 are securedover the ends of the columns and sample loops 280-290 inside theopenings 300. The filters 308 are comprised of sintered stainless steelwith 0.5 micron openings.

The columns 280-286 are packed columns, each of which may be comprisedof a stainless steel tube having an inner diameter of 2 to 4 mm and alength of 1 to 4 meters. Each tube is packed with a suitable adsorbent,which may be organic and/or inorganic, and which is ground and screenedto provide a range of particle sizes that extend from about 30 mesh toabout 120 mesh. Ends of each tube contain stainless steel braided cableterminations to retain the adsorbent. In addition, the filters 308 inthe openings 300 of the spool 278 help prevent migration of theadsorbent. It should be appreciated that in lieu of being packedcolumns, the columns 280-286 may instead be open tubular columns, suchas fused silica open tubular (FSOT) columns. A FSOT column comprises afused silica tube having an exterior polyimide coating and an interiorstationary phase coating comprising a support and an adsorbent. Itshould also be appreciated that the gas chromatograph of the presentinvention is not limited to four columns and two sample loops. The gaschromatograph of the present invention may have any number of columnsand sample loops, provided there is at least one column and at least onesample loop.

The columns and the sample loops 280-290 are wound around the body 294of the spool 278 and have their ends secured to the fitting assemblies302 as described above. The columns and the sample loops 280-290 may bewound by hand or by machine. In addition, the columns and the sampleloops 280-290 may be wound directly on the spool 278, or on a separatedevice and then transferred as a coil to the spool 278. After thecolumns and sample loops 280-290 are wound around the spool 278 andconnected to the fitting assemblies 302, the wound columns and the woundsample loops 280-290 are fully encapsulated in a thermal resin 310,i.e., a resin that is electrically insulating and thermally conductive.An example of a thermal resin is an epoxy resin filled with a conductivemetal or metal compound, such as silver, alumina or aluminum nitride.The thermal resin 310 secures the columns and the sample loops 280-290in position and provides greater isothermal heating and thermalstability of the columns and the sample loops 280-290.

The column assembly 182 is secured to the valve assembly 180 by aplurality of radially-outward screws 312 that extend through the GC PCBA184 and the detector plate 258 and are threadably received in openings314 in the flange 296 of the spool 278. When the column assembly 182 issecured to the valve assembly 180, the mandrel 268 extends through theupper end of the spool body 294 and the pillar 226 of the heater plate176 extends through the lower end of the spool body 294, with both themandrel 268 and the pillar 226 being disposed inside the spool body 294and abutting against each other. In addition, the top side of the flange296 of the spool 278 abuts the annular portion of the lower end surfaceof the detector plate 258. With the flange 296 and the detector plate258 so positioned, the flow openings 297 in the flange 296 are connectedto flow opening in the detector plate 258, thereby connecting the fifthinternal passage network in the valve assembly 180 to the sixth internalpassage network in the spool 278. The gasket 298 of the spool 278 abutsagainst the annular portion of the lower end surface of the detectorplate 258.

The GC PCBA 184 is secured to the detector plate 258 by theradially-outward screws 312, the screws 266 and by the bolt 270. The GCPCBA 184 includes electrical connectors 313 and memory 315 mounted to atop side of a disc-shaped circuit board 316. The memory 315 may beelectrically erasable programmable read-only memory (EEPROM). The memory315 stores factory calibration information, chromatographic calibrationconstants, peak times, settings for the first and second pressureregulator valves 218, 220 and electronic identification of the gaschromatograph 10 and/or the GC module 164, including serial number,revision level and build date. The GC PCBA 184 also includes a firstreference TCD 318, a first sensor TCD 320, a second reference TCD 322, asecond sensor TCD 324, first and second carrier pressure sensors 326,328 and the sample pressure sensor 246, all of which are secured to abottom side of the circuit board 316 and extend downwardly therefrom.When the GC PCBA 184 is secured to the valve assembly 180, the TCDs318-324 and the pressure sensors 246, 326, 328 extend into openings332-344 in an upper side of the detector plate 258, respectively, andbecome connected into the fifth internal passage network of the valveassembly 180. The GC PCBA 184 is connected to the analytical PCA 160 bythe ribbon cable 237 (shown schematically in FIG. 34).

The TCDs 318-324 can be any of a number of types of temperature sensingelements, including but not limited to negative temperature coefficientthermistors (“NTC thermistors”), or platinum RTD's, etc. Thesetemperature sensing elements have a resistance value that varies as afunction of temperature. NTC thermistors are the most common due totheir high thermal sensitivity, or resistance versus temperaturerelationship. The term “thermistor bead” or just “bead” is sometimesused interchangeably since the sensing device is often a sensing elementcoated in glass and suspended on wires between two mounting posts orother support structure.

A thermistor (such as the second TCD 320) is heated by passing a currentthrough it in such a way that it elevates its own temperature andcorrespondingly changes its own resistance, until its reaches a point ofequilibrium such that the energy used to heat the thermistor is balancedby the energy that is dissipated or lost. The rate of energy lost by thethermistor is due to the combination of its own temperature, the thermalconductivity of its own support structure, the thermal conductivity,temperature, heat capacity and flow rate of the surrounding gas, and thetemperature of the wall of the cavity or chamber that houses it. Thismode of operation for the thermistor is referred to as the self-heatedmode. Since the temperature of the chamber wall that the thermistor isplaced in is held fairly constant at one temperature in mostchromatographic applications, the variables that modulate thethermistor's heat loss the most are related to the physical propertiesof the gas flowing by it. Therefore, the gas chromatograph 10 minimizesthe changes in the pressure of the gas as well as its flow rate in thevicinity of the thermistor. This is done in an effort to minimize theamount that these variables modulate the energy loss of the thermistorleaving the thermal conductivity of the gas as the prime variable ofmeasurement. The heat capacity of the gas also contributes to thedetector response, but is less significant.

Although the gas chromatograph 10 is described as using TCDs, it shouldbe appreciated that other detectors are available and may be used in thegas chromatograph.

Oven Enclosure

Referring back to FIG. 12, the oven enclosure 166 is composed of aconductive metal, such as stainless steel or aluminum, and has acylindrical side wall 348, a top end wall 350, and a circular bottomedge 352 defining a bottom opening. An annular groove is formed in aninside surface of the side wall 348. The oven enclosure 166 is disposedover the GC module 164, with the bottom edge 352 resting on the flange230 of the heater plate 176. With the oven enclosure 166 so disposed,the oven enclosure 166 cooperates with the heater plate 176 to define anoven space, within which the GC module 164 is disposed. The ovenenclosure 166 is removably secured to the heater plate 176 by a bayonettype connection formed by the engagement of the bearings 232 of theheater plate 176 with the groove in the interior surface of the sidewall 348 of the oven enclosure 166. The oven enclosure 166 helps conductheat from the heater plate 176 around the column assembly 182 to providea more even temperature distribution within the column assembly 182 andto help isolate the column assembly 182 from the ambient temperatureconditions. A heating element may be secured to the oven enclosure 166to further improve the temperature distribution and thermal isolation ofthe column assembly 182.

Dewar

Referring back to FIGS. 10 and 11, the dewar 356 is cylindrical in shapeand has a hollow interior and a closed outer end. An inner portion ofthe dewar 356 has a narrowed diameter, thereby forming a neck. The neckincludes an exterior thread and an annular rim that defines an enlargedopening through which the interior may be accessed. The dewar 356includes an inner shell nested within an outer shell so as form a narrowspace therebetween. The inner and outer shells are sealed together atthe neck. The narrow space between the inner and outer shell isevacuated almost entirely of air to produce a vacuum that preventsconduction and convection of heat. An inner surface of the outer shelland an outer surface of the inner shell are reflective or havereflective coatings to prevent heat from being transmitted viaradiation. The inner and outer shells may be formed from stainless steelor other metal.

The dewar 356 is disposed over the oven enclosure 166, with the neckthreadably secured to the cap 358 and the interior wall 364 of the cap358 disposed inside the opening in the dewar 356. With the dewar 356 sodisposed, the oven enclosure 166, the GC module 164, the heater plate176 and the spacer 174 are disposed within the interior of the dewar356, which provides an isolated environment in which the temperature ofthe oven space and thus the column assembly 182 can be closelyregulated.

Analytical Processor Assembly

Referring now to FIGS. 28-30, the analytical processor assembly 20includes an analytical PCA 160 secured between first and second mountingplates 398, 400. The analytical PCA 160 and the first and secondmounting plates 398, 400 are secured together and to the secondarymanifold plate 172 by a plurality of threaded bolts 402 fitted withnuts. Each of the bolts 402 extend through four spacers 404, two ofwhich are disposed between the secondary manifold plate 172 and thefirst mounting plate 398, another one of which is disposed between thefirst manifold plate 398 and the analytical PCA 160, and still anotherone of which is disposed between the analytical PCA 160 and the secondmounting plate 400. In this manner, the secondary manifold plate 172,the analytical PCA 160 and the first and second mounting plates 398, 400are spaced apart from each other.

The analytical PCA 160 comprises a digital processor 408, which isdesigned for digital signal processing in real time. As used herein, theterm “real time” means responding to stimuli within a bounded period oftime. In an exemplary embodiment of the present invention, the digitalprocessor 408 is a Blackfin® embedded processor available from AnalogDevices and more particularly, a Blackfin® ADSP-BF533 embeddedprocessor. The digital processor 408 provides fully digital basedcontrol of the flow control devices 210 and the cartridge heaters 150,234 and can operate independently of the main CPU 24. The digitalcontrol provided by the digital processor 408 provides opportunities forperformance enhancements and feature additions without adding hardware.The digital processor 408 communicates with memory 410, which may beserial flash memory having 1 MB storage space. The memory 410 stores allsoftware algorithms run by the digital processor 408 to control the flowcontrol devices 210 and the cartridge heaters 150, 234. In addition, thememory 410 stores a start-up program (or boot program) for the digitalprocessor 408 that runs independently of the start-up program for themain CPU 24. Upon power-up of the gas chromatograph 10, the start-upprogram for the digital processor 408 interfaces with the memory 315 inthe GC PCBA 184 to establish initial values for the process variables ofthe analytical module 16. More specifically, the start-up program: (1.)controls the cartridge heater 234 to set the temperature of the ovenspace to an initial value, which is retrieved from the memory 315; (2.)controls the cartridge heater 150 to set the temperature of thefeed-through module 14 to an initial value, which is retrieved from thememory 315; (3.) controls the first and second pressure regulator valves218, 220 to set the pressures of the carrier gas streams being fed tothe first and second GC valves 188, 190 to initial values, which areretrieved from the memory 315; and (4) sets the pilot valve 216 so as toplace the first and second GC valves 188, 190 in the “backflush” mode.Once the initial values for the process variables of the analyticalmodule 16 are established by the start-up program, the digital processor408 is ready to receive instructions from the main CPU 24 to runspecific chromatographic analysis cycles.

The analytical PCA 160 has a serial communications interface withgalvanic isolation. The serial interface can operate at up to 232 Kbaudfor development and in-house testing purposes. In addition, the serialinterface can be coupled to a personal computer (PC) for diagnostics viaan external hardware level translator. The PC is provided with softwarethat allows real-time observation of high speed, high resolution datafrom any of the on-board systems. A temperature sensor is mounted to thecircuit board.

The provision of the digital processor 408 separate from the CPU 372(i.e., as a separate, stand-alone microprocessor) permits the digitalprocessor 408 to process input signals from sensors and detectors andgenerate control output signals to the flow control devices 210 and thecartridge heaters 150, 234 without having to handle highlynon-deterministic events, such as communications with other devicesexternal to the gas chromatograph 10 and user inputs from the GUI, orhaving to run other software algorithms. This dedication of the digitalprocessor 408 permits the digital processor 408 to process the inputsignals and generate the control output signals in a faster and moreconsistent manner. It also allows for software changes and enhancementsthe main CPU 24 without affecting those functions requiring real-timeprocessing.

Connection to Feed-Through Module

The analytical module 16 is secured to the feed-through module 14 (and,thus, the housing 12) by a single bolt 299 that extends through thealigned main mounting holes 196, 198 in the primary and secondarymanifold plates 170,172 and is threadably received in the threaded bore126 in the base 116 of the connection structure 110 of the feed-throughmodule 14. In order to properly connect the analytical module 16 to thefeed-through module 14, the guide posts 130 on the base 116 must beinserted into the guide holes 179 in the tongue 178 of the primarymanifold plate 170. This ensures that the major face 178 a of the tongue178 properly interfaces with the second major face 124 of the base 116so that the fluid openings 181 are connected to the inner passageopenings 128. The bolt 299 has a hexagonal recess for receiving the endof a hexagonal driver, which is part of a tool kit provided with the gaschromatograph 10. The hexagonal driver has an elongated body so that thehexagonal driver can reach the bolt through the front access opening ofthe main section 22 of the housing 12.

IV. Termination Assembly

Referring now to FIGS. 31-33, the termination assembly 21 comprises adisc-shaped printed circuit board 524 secured to the mounting ears 40 byscrews. The termination assembly 21 provides connections for externalcommunication and power wiring entering the gas chromatograph 10 fromconduits connected to the conduit bosses 50. More specifically, thetermination assembly 21 includes a power input plug 526, anon-configurable RS-232 serial port 528, a pair of configurable serialports 530, and a plurality of input and output hardwire terminals 536,all of which are mounted to an outer side of the PCB 524. The serialports 530 can be configured for RS-232, RS-485 or RS-422. A wirelesstransceiver 540 may also be mounted to the outer side of the PCB 524.Alternately, the wireless transceiver 540 may be mounted to the main CPU24, or elsewhere, such as circuit board disposed between the main CPU 24and a mounting plate 376. The wireless transceiver 540 is connectedbetween the main CPU 24 and the antenna 74. In combination with theantenna 74, the wireless transceiver 540 is operable to providecommunication between the main CPU 24 and a wireless device (such as apersonal digital assistant) using short-range radio frequency datatransmission. The wireless transceiver 540 may be a Bluetooth capabletransceiver that operates in a frequency band from 2.400 to 2.483gigahertz (GHz) and provides up to a 720 kilobits per second (kbps) datatransfer rate within a range of 10 meters and up to 100 meters with apower boost. Alternately, the wireless transceiver 540 may be anultrawideband (UWB) transceiver operating in a frequency band from 3.1to 10.6 GHz. UWB wireless communication is different from other forms ofradio communication. Instead of using a carrier signal, a UWBtransmission is comprised of a series of intermittent pulses. By varyingthe pulses' amplitude, polarity, timing, or other characteristic,information is coded into the transmission.

A conductive EMI/RFI gasket 544 is mounted inside the main section 22 ofthe housing 12 and is disposed around the PCB 524. More specifically, aradially inner circumferential surface of the EMI/RFI gasket 544 is incontact with circumferential edges of the PCB 524 as well ascircumferential portions of the inner surface of the PCB 524. A radiallyouter circumferential surface of the EMI/RFI gasket 544 is in contactwith the inner surface of the main section 22 of the housing 12. TheEMI/RFI gasket 544 abuts the mounting ears 40 and may be secured theretoby the same screws that secure the PCB 524 to the mounting ears 40. TheEMI/RFI gasket 544 may be comprised of a conductive metal, or aconductive elastomeric material. In one embodiment of the invention, theEMI/RFI gasket 544 is comprised of nickel plated beryllium copper.

As set forth above, the power input plug 526, the communication ports530-534 and the hardwire terminals 536 are all mounted on the outer sideof the PCB 524. Electrical circuits are connected to these ports andterminals and pass through the PCB 524 to an inner side of the PCB 524where they are connected to a first cable connector 548 and/or a secondcable connector 550. A filter circuit is connected into each of theseelectrical circuits and is operable to filter unwanted frequencies. Inaddition, the PCB 524 is provided with internal conducting plane layersand a top layer of copper near the hardwire terminals to help provide alow impedance path to the outer circumferential edge of the PCB 524. Alayer of copper is disposed around the outer circumference of the PCB524, on both the inner and outer sides of the PCB 524, and extends overthe circumferential edge. The layer of copper is in contact with theEMI/RFI gasket 544. Thus, the EMI/RFI gasket 544 provides an electricalconnection between the termination assembly 21 and the housing 12. Inthis manner, an EMI/RFI conduction path is provided from the terminationassembly 21 to the housing 12 and, thus, ground.

The termination assembly 21 in combination with the EMI/RFI gasket 544forms an RFI/EMI shield that divides the interior volume of the housing12 into an RFI/EMI-protected compartment 554 and an RFI/EMI-unprotectedcompartment 556. The interior passages in the conduit bosses 50 and thefirst and second communication bosses 46, 48 open into theRFI/EMI-unprotected compartment 556. In addition, the power input plug,the pair of serial ports, the USB port, the Ethernet port, the pluralityof hardwire input terminals and the plurality of hardwire outputterminals are located in the RFI/EMI-unprotected compartment. In thismanner, the communication and power cables and wiring entering thehousing 12 (and which may be conducting RFI/EMI noise) are confined tothe RFI/EMI-unprotected compartment. The termination assembly 21 and theEMI/RFI gasket prevent any RFI/EMI noise entering theRFI/EMI-unprotected compartment from moving into the RFI/EMI-protectedcompartment. The RFI/EMI-protected compartment is bounded on one end bythe shield panel 96 and on the other end by the termination assembly 21in combination with the EMI/RFI gasket. Since the housing 12 is groundedand both the shield panel 96 and the termination assembly 21/EMI/RFIgasket combination provide barriers to RFI/EMI noise, theRFI/EMI-protected compartment is protected from RFI/EMI noise. Theanalytical module 16 and the main electronics assembly 18 are disposedin the RFI/EMI-protected compartment and, thus, are protected fromRFI/EMI noise.

As shown in FIG. 34, the main CPU 24 communicates with the analyticalPCA 160 through the termination assembly 21. More specifically, the mainCPU 24 is connected by a ribbon cable 558 (shown schematically in FIG.34) to the first cable connector 548 on the termination assembly 21, andthe analytical PCA 160 is connected by a cable 560 (shown schematicallyin FIG. 34) to the second cable connector 550 on the terminationassembly 21. Communication from the main CPU 24 to the analytical PCA160 travels through the ribbon cable 558 to the first cable connector548 of the terminal assembly 21, through the PCB 524 to the second cableconnector 550 and then through the cable to the analytical PCA 160.Communication from the analytical PCA 160 to the main CPU 24 occurs overthe same path, but in the opposite direction. The GC PCBA 184communicates with the analytical PCA 160 over the ribbon cable 237 thatextends through the channel 236 in the heater plate 176.

V. Main Electronics Assembly

Referring now to FIGS. 34-37, the main electronics assembly 18 comprisesthe main CPU 24, a display PCA 374, a mounting plate 376, a mountingring 378 and an outer bezel 382 with an enlarged opening.

The main CPU 24 handles system-level initialization, configuration, userinterface, user command execution, connectivity functions, and overallsystem control of the electronics for the gas chromatograph 10. The mainCPU 24 comprises a microprocessor mounted to a printed circuit board.The microprocessor may be an X86-type microprocessor, a RISCmicroprocessor (such as an ARM, DEC Alpha, PA-RISC, SPARC, MIPS, orPowerPC), or any other microprocessor suitable for use in a compactportable electronic device. In an exemplary embodiment, themicroprocessor comprises a RISC core, which may be an ARM core, moreparticularly a 16/32-bit ARM9 core, still more particularly a 16/32-bitARM920T core. The RISC core has a 16-bit Thumb instruction set, a 32-bitAMBA bus interface, a 5-stage integer pipeline, an 8-entry write buffer,separate 16 KB Instruction and 16 KB Data Caches and an MMU, whichhandles virtual memory management and is capable of supporting Windows®CE. An ARM9 core (including the ARM920T) is a 16/32 RISC processordesigned by Advanced RISC Machines, Ltd. The RISC core is integratedwith a set of common system peripherals, which includes a card interfacefor a secure digital (SD) flash memory card or a multimedia card, an LCDcontroller, an external memory controller, a multi-channel universalserial asynchronous receiver transmitter (USART), a watch dog timer,power management and USB host/device interface. An example of acommercially available microprocessor with a RISC core that may be usedfor the microprocessor is the S3C2410 microprocessor available fromSamsung. An operating system, such as Windows® CE runs on themicroprocessor. A memory system is connected to the microprocessor andincludes volatile memory, such as a read-write memory (RAM) and anon-volatile memory such as boot read only memory (ROM). Thenon-volatile memory stores a start-up program (or boot program) for themicroprocessor of the main CPU 24.

The main CPU 24 may also include an embedded TCP/IP stack and an HTTPweb-server. In addition, the main CPU 24 may include a common gatewayinterface (CGI) module for communicating web page content to and fromapplications running in the main CPU 24 and the digital processor 408.

An SD socket is mounted to the printed circuit board of the main CPU andcommunicates with the card interface of the microprocessor. The SDsocket holds an SD flash memory card. The SD flash memory card is small(measuring only 32 mm by 24 mm by 2.1 mm) and has a large amount ofmemory (such as 16 MB) that can store data from the operation of the gaschromatograph 10. The SD flash memory card may be removed from the gaschromatograph 10 and easily transported to another location where thestored data from the gas chromatograph 10 may be retrieved. A lithiumbattery 380 is connected to the main CPU 24 for providing backup powerthereto.

The display PCA 374 includes a circular printed circuit board (PCB) 383mounted behind the outer bezel 382. A VGA LCD display screen 384 ismounted to an outer side of the PCB 383 such that the display screen 384is visible through the opening in the outer bezel 382. An infrared port388 and a plurality of backlight LEDs 390 are mounted to the outer sideof the PCB 383. The infrared port 388 is aligned with an opening in theouter bezel 382 and is operable to transmit and receive data via nearinfrared light waves (850-900 nm) in accordance with the Infrared DataAssociation (IrDA) standard and communicates with the microprocessorthrough the USART. When the display PCA 374 is mounted in the housing12, behind the shield panel 96, the display screen 384 is positioned soas to be viewable through the shield panel 96 and the infrared port 388is positioned so as to be able receive and transmit infrared signalsthrough the shield panel 96.

As shown in FIG. 37, a plurality of Hall-effect switches 600 are mountedto an inner side of the PCB 383 of the display PCA 374. Thus, theHall-effect switches 600 are mounted behind the LCD display screen 384and are separated from the LCD display screen 384 by the PCB 383 of thePCA 374. The number of Hall-effect switches 600 is limited and issubstantially less than the number of liquid crystal cells forming theLCD display screen 384. The Hall-effect switches 600 are arranged in apattern, such as a rectangle or a line, and are connected to the mainCPU 24. As shown in FIG. 7, six Hall-effect switches 600 may be arrangedin a rectangular pattern having a center that is aligned with the centerof the LCD display screen 384. Each Hall-effect 600 switch may be amonolithic silicon chip that includes a Hall-effect element (HEE)coupled to a differential amplifier, which, in turn is coupled to aSchmitt-trigger threshold detector with built-in hysteresis. When amagnetic field is applied to the HEE, the HEE generates a Hall effectvoltage, which is applied to the differential amplifier. Thedifferential amplifier produces an output signal proportional to theHall effect voltage. When the output signal from the differentialamplifier is above a predetermined magnitude, the Schmitt-triggerthreshold detector produces a digital “ON” signal, which is transmittedto the main CPU 24. Each of the Hall-effect switches 600 may beconfigured to activate, i.e., produce an “ON” signal when theHall-effect switch 600 is disposed in a positive magnetic field.Alternately, each of the Hall-effect switches 600 may be configured toactivate when the Hall-effect switch 600 is disposed in either apositive magnetic field or a negative magnetic field. As will bedescribed more fully below, the Hall-effect switches 600 are used tonavigate through a graphical user interface (GUI) of the gaschromatograph 10.

The display PCA 374, the main CPU 24 and the mounting plate 376 aresecured together by a plurality of threaded bolts 392 fitted with nuts.Each of the bolts 392 extend through a pair of spacers 394, one of whichis disposed between the display PCA 374 and the main CPU 24 and theother of which is disposed between the main CPU 24 and the mountingplate 376. In this manner, the display PCA 374, the main CPU 24 and themounting plate 376 are spaced apart from each other. The mounting plate376 is secured by a plurality of legs 396 to the mounting ring 378,which comprises a stainless steel hose clamp. The main electronicsassembly 18 is mounted on the dewar 356 by disposing the mounting ring378 over the dewar 356 such that the mounting plate 376 rests on theouter end of the dewar 356. A clamping mechanism of the mounting ring378 is then adjusted to clamp the mounting ring 378 to the dewar 356.

VI. Communication with the GC

The operating system running on the main CPU 24 supports the GUI, whichallows a user to view and control the operation of the gas chromatograph10. Referring now to FIGS. 38, 39 and 40, the GUI includes a pluralityof windows that are displayable on the LCD display screen 384. Thewindows, which are generated and controlled by a GUI softwareapplication running on the main CPU 24, include an NGC Menu window 610,an Analyzer Control window 612, a Diagnostic Summary window 613, anAlarm Log window 614, a Calibration Results window 616, a CurrentResults window 618, a Chromatograph Viewer window 620, and chromatogramwindows 622. Navigation through the windows and selection of optionspresented therein are accomplished using the Hall-effect switches 600and a stylus (not shown) containing a magnet.

The NGC Menu window 610 includes six selection button icons, namely anAnalyzer Control button 626, a Chrom Display button 628, a Cal Resultsbutton 630, a Current Results button 632, an Alarms button 634 and aBack button 636. The six buttons 626-636 are aligned with the sixHall-effect switches 600 that are disposed behind the LCD display window384, respectively. Actuation of one of the buttons 626-634 will causethe window associated with the actuated button to be displayed on theLCD display window 384 in lieu of the NGC Menu window 610. For example,actuation of the Analyzer Control button 626 will cause the AnalyzerControl window 612 to be displayed on the LCD display screen 384,selection of the Chrom Display button 628 will cause the ChromatographViewer window 620 to be displayed on the LCD display screen 384, and soon. A desired button is “actuated” by placing the stylus against or inclose proximity to the shield panel 96 and in alignment with the desiredbutton. This placement of the stylus activates the Hall-effect switch600 aligned with the desired button. The “On” signal generated by theactivated Hall-effect switch 600 is input to the GUI softwareapplication, which then causes the LCD display screen 384 to display thewindow associated with the selected button. The “actuation” of otherbuttons in other windows is performed in the same manner (i.e., with thestylus) and pursuant to the same operating mechanism (i.e., magneticallyactivating an aligned Hall-effect switch 660).

As set forth above, the Analyzer Control window 612 is accessed from theNGC Menu window 61. The Analyzer Control window 612 includes fiveselection button icons, namely a Command button 640, a Stream button642, a Send button 644, a Diagnostics button 646 and a Back button 648.These five buttons are aligned with five of the six Hall-effect switches600. The Command button 640 and the Stream button 642 are each operatedin a scrolling manner to select an option. For example, the Streambutton 642 is used to select one of four options, namely Stream 1,Stream 2, Stream 3, or Stream 4. When the Analyzer Control window 612 isbeing displayed on the LCD display screen 384, a first actuation of theStream button 642 (i.e., activation (with the stylus) of the Hall-effectswitch 600 aligned with the Stream button 642) causes the GUI softwareapplication to display Stream 1 in the Stream button 642 (as shown). Inother words, Stream 1 is provisionally selected. After the Hall-effectswitch 600 is deactivated by moving the stylus away from the LCD displayscreen 384, a second actuation of the Stream button 642 causes the GUIsoftware application to display “Stream 2” in the Stream button 642,i.e., Stream 2 is provisionally selected. In the same manner, a thirdactuation provisionally selects Stream 3, a fourth actuationprovisionally selects Stream 4, a fifth actuation provisionally selectsStream 1 again, and so on. Similar to the Stream button 642, the Commandbutton 640 is actuated in a scrolling manner to display one of fivecommands in the Command button 604, i.e., to provisionally select one offive commands. These commands are: “Nop”, “Abort”, “Hold”, “Cal” and“Run”.

Once a user has provisionally selected a stream (e.g. Stream 1) and acommand (e.g. Run), the user actuates the Send button 644 (i.e.,activates the Hall-effect switch 600 aligned with the Send button 644),which causes the GUI software application to command the digitalprocessor 408 to perform an analysis of the composition of Stream 1. Inresponse, the digital processor 408, inter alia, actuates the samplevalve 212 a for Stream 1 to feed the gas of Stream 1 to the first andsecond sample loops 288, 290, and then, after a predetermined period oftime, places the first and second GC valves 188, 190 into the “injectmode”.

Actuation of the Diagnostics button 646 in the Analyzer Control window612 causes the GUI software application to display the DiagnosticSummary window 613, which, inter alia, displays the pressures in thefirst and second columns 282, 286 and the temperature in the oven space.Actuation of the Back button 648 causes the GUI software application togo back and again display the NGC Menu window 610.

From the NGC Menu window 610, a user can also access the Current Resultswindow 618 by actuating the Current Results button 630 and can accessthe Chrom Viewer window 620 by actuating the Chrom Display button 628.The Chrom Results window 618 displays the composition of a selected gasstream in a tabular format. The Chrom Viewer window 620 provides accessto the chromatogram windows 622. The chromatogram windows 622 displaychromatograms for the gases of Streams 1, 2, 3 and 4, respectively. Inthis regard, it should be noted that a chromatogram is a plot of theoutput signal of a detector (e.g. TCD 320 or TCD 324) versus time andshows the Gaussian peaks for the various gas components, as is describedmore fully below.

In addition to communicating with the gas chromatograph 10 through theGUI, a user at the site where the gas chromatograph 10 is installed maycommunicate with the gas chromatograph 10 through a mobile interfacedevice (such as a laptop computer, or personal digital assistant) havinga USB port, a Bluetooth transceiver and/or an infrared port. If themobile device is equipped with a USB port, the mobile device maycommunicate with the gas chromatograph 10 over a cable connected to thecommunication port 88 of the gas chromatograph 10. If the mobile deviceis equipped with a Bluetooth transceiver, the mobile device maycommunicate with the gas chromatograph 10 via radio signals transmittedbetween the mobile device and the antenna 74 and the wirelesstransceiver in the gas chromatograph 10. If the mobile device isequipped with an infrared port, the mobile device may communicate withthe gas chromatograph 110 via infrared light transmitted between themobile device and the infrared port 388 of the gas chromatograph 110. Itshould be noted that if communication port 88 is in use, i.e., connectedto another device, the infrared port 388 is made inactive.

Communication with the gas chromatograph 10 from a remote location mayalso be accomplished using a serial line connected to one of the serialports 528, 530 in the termination assembly 21. The gas chromatograph 10may also be connected through the Ethernet port 534 in the terminationassembly 21 to a local area network (LAN), a wide area network (WAN), orthe Internet. Web pages similar, if not identical to the windows 610-622in the GUI, may be generated by the web server in the main CPU 24 andtransmitted over the Internet to a user at a remote location.

VII. GC Features and Operation

It should be appreciated from the foregoing description that the gaschromatograph 10 has a modular construction that permits the gaschromatograph 10 to be quickly and easily disassembled and reassembled.This is advantageous because it permits the GC module 164 to be facilelyreplaced with another GC module that is constructed to analyze a gasdifferent than the gas analyzed by the GC module 164. In this manner,the gas chromatograph 10 can be modified to analyze many different typesof gases.

Each replacement GC module has substantially the same construction asthe GC module 164, except for the columns 280-286. Each replacement GCmodule has columns that are specifically constructed for measuring aparticular gas.

A GC module 164 may be swapped with a replacement GC module 164 whilethe analytical module 16 remains disposed in the housing 12 and securedto the feed-through module 14, or the GC module 164 may be swapped witha replacement GC module 164 after the entire analytical module 16 hasbeen unfastened from the feed-through module 14 and removed from thehousing 12. Either way, the front access cover 28 is unthreaded from thefront collar 34 and removed. The clamping mechanism of the mounting ring378 is then loosened and the main electronics assembly 18 is removedfrom the dewar 356. If the entire analytical module 16 is being removed,the bolt 299 is removed using the hexagonal driver and the analyticalmodule 16 is pulled through the front access opening in the main section22 of the housing 12. The dewar 356 is unthreaded from the cap 358 andremoved, thereby exposing the oven enclosure 166. The oven enclosure 166is then removed from engagement with the heater plate 176 by pulling theoven enclosure 166 away from the heater plate 176 and the rest of themanifold module 162. With the oven enclosure 166 so removed, the GCmodule 164 is now exposed. The ribbon cable 237 is first disconnectedfrom the GC PCBA 184 and then the GC module 164 is rotatedcounter-clockwise to unthread the bolt 270 from the heater plate 176.After the GC module 164 is unthreaded and removed, the replacement GCmodule is then mounted to the manifold module 162 by threading its bolt270 into the central bore 240 of the heater plate 17 and connecting theribbon cable 237 to the replacement GC module. The oven enclosure 166and the dewar 356 are then reinstalled. If the entire analytical module16 was removed from the housing 12, the analytical module 16 isreinserted into the main section 22 through the front access openingthereof and secured to the feed-through module 14 with the bolt 299. Themain electronics assembly 18 and the front access cover 28 are thenreinstalled.

As with the GC module 164, each replacement GC module contains a memory315 that stores calibration and other characterization data for thereplacement GC module. The storage of calibration and othercharacterization data in the memories 315 of the GC module 164 and thereplacement GC module, respectively, as opposed to other morecentralized memory, such as the memory 410 for the digital processor408, permits the GC module 164 to be swapped with the replacement GCmodule without having to reprogram memory, which greatly simplifies thereplacement process.

Referring now to FIGS. 41 and 42, there are shown schematics of flowpaths of sample gas and carrier gas through the gas chromatograph 10.More specifically, FIGS. 41 and 42 show schematics of a GC flow circuit500 that comprises the inlet and vent paths through the feed-throughmodule 14 and the first through sixth internal passage networks in theprimary manifold plate 170, the secondary manifold plate 172, the spacer174, the heater plate 176, the valve assembly 180 and the spool 278,respectively. The GC flow circuit 500 is, inter alia, represented bylines 502, 504, 506, 508, 510, 512, 514 and is interconnected with theelectrical flow devices 210 and the first and second GC valves 188, 190.As set forth above, the first and second GC valves 188, 190 each haveports 1-10 and are movable between a “backflush” mode and an “inject”mode. Line 502 connects port 10 of the second GC valve 190 to the samplevent. Line 504 connects port 1 of the first GC valve 188, through theshut-off valve 214, to a selected one of the sample inputs. Line 506connects port 8 of the first GC valve 188, through the first pressureregulator valve 218, to the carrier gas input. Line 508 connects port 8of the second GC valve 190, through the second pressure regulator valve220, to the carrier gas input. Line 510 connects port 4 of the first GCvalve 188 to column vent 1. Line 512 connects the first and second GCvalves 188, 190, through the pilot valve 216, to the carrier gas input.Line 514 connects port 4 of the second GC valve 190 to the column 2vent. Line 516 connects port 10 of the first GC valve 188 to port 1 ofthe second GC valve 190.

When the first and second GC valves 188, 190 are in the “backflush”mode, as shown in FIG. 41, a stream of sample gas flows from a selectedone of the sample inputs through line 504 to port 1 to port 2 of thefirst GC valve 188, through the first sample loop 288 and thence to port9 to port 10 of the first GC valve 188. From port 10 of the first GCvalve 188, the stream of sample gas flows through line 516 to port 1 toport 2 of the second GC valve 190, through the second sample loop 290and thence to port 9 to port 10 of the second GC valve 190. The streamof sample gas then flows through line 502 to the sample vent. Thus,while the first and second GC valves 188, 190 are in the “backflush”mode, the first and second sample loops 288, 290 are filled with firstand second gas samples, respectively. If the first and second GC valves188, 190 are then moved to the “inject” mode, the first and second gassamples are trapped within the first and second sample loops 288, 290.

When the first and second GC valves 188, 190 are in the “inject” mode(as shown in FIG. 42), the carrier gas flows through lines 506, 508 andthe first and second reference TCDs 318, 322 to the ports 8 of the firstand second GC valves 188, 190. In the first GC valve 188, the carriergas flows to port 9 and into the first sample loop 288, and in thesecond GC valve 190, the carrier gas flows to port 9 and into the secondsample loop 290. The carrier gas entering the first and second sampleloops 288, 290 forces the first and second gas samples trapped thereinto exit the first and second sample loops 288, 290 through ports 2 ofthe first and second GC valves 188, 190, respectively. The first gassample travels to port 3 of the first GC valve 188, then passes throughthe first preliminary column 280 to port 6 to port 7 of the first GCvalve 188, then passes through the first column 282, travels to port 5and exits the first GC valve 188 through port 4. Similarly, the secondgas sample travels to port 3 of the second GC valve 190, then passesthrough the second preliminary column 284 to port 6 to port 7 of thesecond GC valve 190, then passes through the second column 286, travelsto port 5 and exits the first GC valve 188 through port 4. Afterrespectively exiting the first and second GC valves 188, 190, the firstand second gas samples feed into the first and second sensor TCDs 320,324, respectively, where the gas samples are analyzed, as will bedescribed further below. The first and second gas samples then travel tothe column 1 and column 2 vents through lines 510, 514, respectively.

After the first and second gas samples have been analyzed and the firstand second GC valves 188, 190 are moved back to the “backflush” mode,carrier gas backflushes the first, second, third and fourth TCDs318-324, the first and second preliminary columns 280, 284 and the firstand second columns 282, 286 to remove remnants of the first and secondgas samples. With regard to the first GC valve 188, the backflush travelpath of the carrier gas is the first TCD 318, port 8, port 7, the firstcolumn 282, port 5, port 6, the first preliminary column 280, port 3,port 4, the second TCD 320 and then through line 510 to the column 1vent. With regard to the second GC valve 190, the backflush travel pathof the carrier gas is the third TCD 322, port 8, port 7, the secondcolumn 286, port 5, port 6, the second preliminary column 284, port 3,port 4, the fourth TCD 324 and then through line 514 to the column 2vent.

As described above, the GC module 164 (which includes the TCDs 318-324and the first and second GC valves 188, 190 and associated flow paths)receives a single stream of sample gas, divides the stream into a pairof gas samples and analyzes the gas samples in parallel. Such parallelanalysis is faster than conventional serial analysis. It should beappreciated that the analysis speed can be increased further byutilizing additional GC valves and TCDs so as to analyze three or moresamples in parallel.

For ease of description, only the analysis of the first gas sample willbe discussed, it being understood that the analysis of the second gassample is substantially the same. As the first gas sample travelsthrough the columns 280, 282 the components of the first gas sampleseparate from one another by virtue of differences in their rates ofinteraction (absorption and de-absorption) with the adsorbents in thecolumns 280, 282. The different components are therefore retained in thecolumns 280, 282 for different lengths of time and arrive at the secondTCD 320 (sense detector) at different, characteristic times. The designof the columns 280, 282, their operating conditions, such astemperature, and gas flow, are optimized and carefully controlled so asto provide good and consistent separation between the components.

Referring now to FIG. 43, there is shown a schematic electrical diagramof the first reference TCD 318 and the first sensor TCD 320 connected toamplifier circuits 650, 651, respectively. Both the first reference TCD318 and the first sensor TCD 320 are operated in a constant temperaturemode, as will be described below. The amplifier circuits 650, 651 aremounted on the analytical PCA 160. For purposes of brevity, only thestructure and operation of the first sensor TCD 320 and its amplifiercircuit 651 will be described, it being understood that the structureand operation of the first reference TCD 318 and its amplifier circuit650 is substantially the same, except the first reference TCD 318 is incontact with the carrier gas.

The amplifier circuit 651 comprises a Wheatstone bridge circuit 652having two arms with resistances Ra and Rb, respectively. The other twoarms have the first sensor TCD 320 and a resistance R1, respectively.The TCD 320 is in contact with the first gas sample exiting port 4 ofthe first GC valve 188 and operates in a self-heated mode. The bridgecircuit 652 is connected to an operational amplifier 654 (acting as aservo amplifier), which is connected to an analog-to-digital (A-D)converter 656, which is, in turn, connected to the digital processor408. Optionally, an amplifier 658 may be connected between the servoamplifier 654 and the A-D converter 656. The output of the servoamplifier 654 is fed back to the top of the bridge circuit 652.

The servo amplifier 654 and the bridge circuit 652 act in concert tomaintain the temperature of the first sensor TCD 320 at a constanttemperature. This happens because the servo amplifier 654 has itsinverting and non-inverting inputs connected to the output terminals ofthe bridge circuit 652. The servo amplifier 654 acts to “servo” or steerthe bridge circuit 652 outputs to a null voltage output (i.e. zeroVolts) by increasing or decreasing its output voltage which provides thebias voltage for the bridge circuit 652. Because of this serving actionof the servo amplifier 654, the current through the first sensor TCD 320and the voltage across the first sensor TCD 320 are both varied which inturn correlates to the power being dissipated by the first sensor TCD320 itself being raised or lowered to the point that it's temperatureand thus it's resistance is always maintained at a constant value,consistent with the following relationship: Ra/Rb=S1/R1. The speed ofthermal response of the first sensor TCD 320 as well as the outputvoltage of the servo amplifier 654 is such that the servo amplifier 654can maintain the bridge circuit 652 nulled at all times during changesin the detector cell thermal conductivity due to the elution of theseparated gas components corresponding to chromatographic peaks duringthe chromatographic cycle. The output voltage of the servo amplifier 654has a direct correspondence to the power being dissipated by the firstsensor TCD 320 itself. Since the first sensor CD 320 is maintained at aconstant temperature, it is referred to as being operated in a constanttemperature mode.

The location of the first sensor TCD 320 in the bridge circuit 652, andthe connection of the inverting and non-inverting amplifier inputs, asthe depicted, is exemplary. The location of the first sensor TCD 320 canactually be located in any one of the four arms of the bridge circuit652, and through the proper connection of the inverting andnon-inverting inputs of the servo amplifier 654, the same describedbehavior may be realized.

The output signal from the servo amplifier 654 (or the optionalamplifier 658) of the amplifier circuit 654 has bell-like distributions,which are often referred to as Gaussian peaks. The portions of theoutput signal between the Gaussian peaks is attributable to the thermalconductivity and heat capacity of the carrier gas alone and is referredto as the “baseline”, whereas each of the Gaussian peaks is attributableto the combination of the carrier gas and the thermal conductivity andheat capacity of a component of the first gas sample. The amount ofseparation between the Gaussian peaks is called “baseline separation”.

The amplifier circuit 650 for the first reference TCD 318 generates anoutput signal for the carrier gas alone. This output signal does notcontain Gaussian peaks.

The digitized output signal from the amplifier circuit 651 (the “sense”signal) and the digitized output signal from the amplifier circuit 650(the “reference” signal) are each input to the digital processor 408. Asoftware algorithm stored in the memory 410 and run by the digitalprocessor 408 may be used to subtract the reference signal from thesense signal in order to remove the large signal attributable to thethermal conductivity of the carrier gas present at both the firstreference TCD 318 and the first sensor TCD 320. As a result of thissubtraction, any variation in oven space temperature affecting both thefirst and second TCDs 318, 320 is largely canceled. Of course, thesubtraction software algorithm may be performed by the main CPU 24instead of by the digital processor 408.

In lieu of using both the reference signal from the amplifier circuit650 and the sense signal from the amplifier circuit 651 to quantify thecomponents of the sample gas, Applicant have found that the same, if notbetter, results can be obtained using only the sense signal from thefirst sensor TCD 320. This is accomplished by a software algorithmstored in the memory system of the main CPU 24 and run on themicroprocessor of the CPU 24 that, for each Gaussian peak, approximatesa baseline that would be present if the Gaussian peak was not there.This approximation may be a straight line method connecting what wouldbe the starting point of the Gaussian peak to the ending point of theGaussian peak. The amplitude of each point along this line is thensubtracted from each point along the Gaussian peak above it having thesame time value. These difference values are then summed together toprovide the total area under the curve (Gaussian peak). In other words,the curve is integrated. This integral value (area under the curve)represents the amount of a component present in the first gas sample andwhich is responsible for the Gaussian peak. Since the thermalconductivities and heat capacities of the various components are not thesame, each of these peak areas are first multiplied by an appropriatecorrection factor for that specific peak called a response factor. Eachof the response factors for the components being analyzed is determinedempirically through the use of a calibration gas with known quantitiesof individual components.

The use of only the sense signal from the first signal TCD 320 toquantify the components in the first gas sample eliminates some of theerrors that may occur in the signal subtraction method that arise fromvariations in flow, pressure and temperature of the gases at the firstreference TCD 318 and the first sensor TCD 320.

For repeatable quantification of gas components, the temperature of theTCDs 318-324, the columns 280-286, the first and second sample loops288, 290 and the first and second GC valves 188, 190 are closelyregulated to maintain a constant temperature. This close regulation isfacilitated by integrating the foregoing components into the GC module164, mounting the GC module 164 on the heater plate 176, and enclosingboth the GC module 164 and the heater plate 176 in the thermallyinsulating dewar 356, which is supported on the thermally insulatingspacer 174. The heater plate 176 is heated by the cartridge heater 234.The temperature of the heater plate 176 is sensed by the oventemperature sensor 238, which is an NTC thermistor-type temperaturesensor. The oven temperature sensor 238 generates a temperature signalwhich is transmitted to input circuitry in the analytical PCA 160, whichconditions and digitizes the signal and then passes the signal to thedigital processor 408. Using the digitized temperature signal from theoven temperature sensor 238, the digital processor 408 determines thecorrect control response for heating the GC module 164 and then outputsa pulse-width modulated control signal to a power transistor which thensources current to the cartridge heater 234. The digital processor 408uses a software-implemented PID (Proportional-Integral-Derivative)-typecontrol algorithm stored in the memory 410 to generate the controlsignal that controls the cartridge heater 234 and, thus, the temperatureof the oven space. By having the temperature control algorithm performedin software, information about the temperature control process can beprovided to the main CPU 24. Such information may include the oven powerbeing used, which can provide valuable diagnostic information.

In addition to the temperature of the GC module 164, the pressure of thecarrier gas is closely controlled. This is significant because even verysmall changes in gas pressure cause changes in gas density, which, inturn changes the thermal conductivity of the carrier, thereby resultingin a deflection in the output signal of the first reference TCD 318.Very small changes in the carrier gas pressure also causes pressurechanges across the first GC valve 188, the columns 280, 282, etc., whichalso results in a deflection in the output signal of the first sensorTCD 320, as well as changes in the retention times of the Gaussianpeaks, which affects measurement repeatability.

The first and second carrier pressure sensors 326, 328 generate pressuresignals which are transmitted to input circuitry in the analytical PCA160, which conditions and digitizes the signals and then passes thesignals to the digital processor 408. Since the first and second carriergas pressure sensors 326, 328 are located on the GC PCBA 184 in thethermally stable oven space defined by the oven enclosure 166 and theheater plate 176, the first and second carrier gas pressure sensors 326,328 do not need to be temperature compensated. Using the digitizedpressure signals from the first and second carrier pressure sensors 326,328, the digital processor 408 determines the correct control responsefor providing carrier gas to the first and second GC valves 188, 190 andthen outputs pulse-width modulated control signals to power transistorswhich then source currents to the first and second pressure regulatingvalves 218, 220. The digital processor 408 uses a software-implementedPID (Proportional-Integral-Derivative)-type control algorithm togenerate the control signals that control the first and second pressureregulating valves 218, 220. By having the pressure control algorithmperformed in software, information about the pressure control processcan be provided to the main CPU 24. This information includes valuablediagnostic information about the control signals driving the first andsecond pressure regulating valves 218, 220, as well as the error termbeing computed within the software. Such information provides a measureof the effort being expended to control the first and second pressureregulating valves 218, 220, which, in turn can be used to determine if aleak exists in the GC flow circuit 500 by watching the trend of thiscontrol variable at the level of the Main CPU 24.

Since the feed-through module 14 can become nearly as cold as theambient air around it on a cold day, the sampled gas that flows throughit can experience similar temperatures. Depending on the type of samplegas, its composition may be such that some components will condense(making the transition from a gas phase to a liquid phase) and cling tothe passage walls of the feed-through module 14 when exposed to thesecold temperatures. The temperature at which this transition occurs iscalled the dewpoint. If this occurs, the gas chromatograph 10 will nolonger be making an accurate measurement of the composition of thesampled gas, since some of the components will not reach the GC module164 of the gas chromatograph in their correct proportions. Then, whenthe ambient temperature warms back up sufficiently, the condensedcomponents will transition back to the gas phase and cause themeasurements being made at that time to be in error again, with somecomponents appearing in greater quantity than they really are in the gasbeing sampled at that time. An example of this is the dewpoint ofNatural Gas with a BTU Value of 1050 BTU. Depending on the exactcomposition, this gas may have a dewpoint of around 30-40 deg F. Byheating the feed-through module 14 to several degrees above thatthreshold, say 50-60 deg F., the accuracy of the gas chromatograph 10 isnot impaired. This of course assumes that the tubing carrying thesampled gas is also heated from the source up to the feed-through module14.

In order to prevent the condensation of the sampled gas in thefeed-through module 14, the feed-through module 14 is provided with thecartridge heater 150 and the temperature sensor 152. The temperature ofthe connection structure 110 is sensed by the temperature sensor 152.The temperature sensor 152 generates a temperature signal which istransmitted to input circuitry in the analytical PCA 160, whichconditions and digitizes the signal and then passes the signal to thedigital processor 408. Using the digitized temperature signal from thetemperature sensor 152, the digital processor 408 determines the correctcontrol response for heating the connection structure 110 and thenoutputs a pulse-width modulated control signal to a power transistorwhich then sources current to the cartridge heater 150. The digitalprocessor 408 uses a software-implemented PID(Proportional-Integral-Derivative)-type control algorithm to generatethe control signal that controls the cartridge heater 150 and, thus, thetemperature of the connection structure 110. By having the temperaturecontrol algorithm performed in software, information about thetemperature control process can be provided to the main CPU 24.

It should be noted that the analytical PCA 160 utilizes pulse widthmodulation (PWM) drive for all the flow control devices 210. Thispermits 12V devices to be utilized with 24V system voltages because thedigital processor 408 can dynamically change the average current beingsourced to each device based on the instantaneous system voltage that italso measures. This feature also achieves a significant reduction in thepower being dissipated by the devices under normal operation by usingpick and hold current drive methods, often reducing the instantaneouspower consumed by the devices by up to 75%, thereby reducing overallsystem power requirements, and making the gas chromatograph 10 moresuitable for low power operation.

While the invention has been shown and described with respect toparticular embodiments thereof, those embodiments are for the purpose ofillustration rather than limitation, and other variations andmodifications of the specific embodiments herein described will beapparent to those skilled in the art, all within the intended spirit andscope of the invention. Accordingly, the invention is not to be limitedin scope and effect to the specific embodiments herein described, nor inany other way that is inconsistent with the extent to which the progressin the art has been advanced by the invention.

1. A gas chromatograph (GC) module for mounting in a gas chromatographassembly, the GC module comprising: a support structure; a separationdevice operable to separate components of a gas, the separation devicebeing mounted to the support structure; a circuit assembly mounted tothe support structure and comprising non-volatile memory for storinginformation relating to the operation of the gas chromatograph assemblywith the GC module.
 2. The GC module of claim 1, wherein the circuitassembly further comprises a printed circuit board to which thenon-volatile memory is mounted.
 3. The GC module of claim 2, wherein theprinted circuit board is a flexible circuit.
 4. The GC module of claim2, wherein the non-volatile memory comprises electrically erasableprogrammable read-only memory (EEPROM).
 5. The GC module of claim 2,wherein the circuit assembly further comprises a detector for detectingthe components of the gas, the detector being mounted to the printedcircuit board.
 6. The GC module of claim 5, wherein the circuit assemblyfurther comprises a pressure sensor for measuring the pressure of thegas provided to the GC module, the pressure sensor being mounted to theprinted circuit board.
 7. The GC module of claim 1, wherein theseparation device comprises at least one column.
 8. The GC module ofclaim 7, wherein the at least one column is wound into a coil.
 9. The GCmodule of claim 8, wherein the at least one column comprises a pluralityof columns.
 10. The GC module of claim 8, wherein the at least onecolumn is encapsulated in a conductive resin.
 11. The GC module of claim1, wherein the non-volatile memory stores information selected from thegroup consisting of factory calibration information, chromatographiccalibration constants, settings for control devices and informationidentifying the gas chromatograph and combinations of the foregoing. 12.The GC module of claim 1, wherein the detector comprises a thermalconductivity detector.
 13. A gas chromatograph (GC) module for mountingin a gas chromatograph assembly having a microprocessor, the GC modulecomprising: a support structure; a column assembly secured to thesupport structure, the column assembly comprising at least one columnfor separating components of a gas, the at least one column being woundinto a coil; a printed circuit board mounted to the support structure;and an electronic device mounted to the printed circuit board andoperable to provide information about the operation of the gaschromatograph with the GC module to the microprocessor, the electronicdevice not being a detector for detecting the components of the gas. 14.The gas chromatograph of claim 13, wherein the electronic device isselected from the group consisting of a pressure sensor and non-volatilememory.
 15. The GC module of claim 14, wherein the at least oneelectronic device comprises a pressure sensor and non-volatile memory,and wherein the pressure sensor is operable to measure the pressure ofthe gas provided to the GC module, and the non-volatile memory isoperable to store information relating to the operation of the gaschromatograph assembly with the GC module.
 16. The GC module of claim15, further comprising a detector for detecting the components of thegas, the detector being mounted to the printed circuit board.
 17. The GCmodule of claim 13, wherein the support structure comprises a mandreland wherein the coil is disposed around the mandrel.
 18. The GC moduleof claim 17, wherein the mandrel comprises a valve assembly comprising aplurality of connected plates, the valve assembly being operable tocontrol the flow of the gas to the at least one column, wherein thevalve assembly is movable between two states.
 19. The GC module of claim18, wherein the valve assembly comprises a first plate, a second plate,a third plate, a first flexible diaphragm and a second flexiblediaphragm, and wherein the first diaphragm is disposed between the firstand second plates and the second diaphragm is disposed between thesecond and third plates.
 20. A gas chromatograph (GC) module formounting in a gas chromatograph assembly, the GC module comprising: asupport structure; a separation device operable to separate componentsof a gas, the separation device being mounted to the support structure;and a circuit assembly mounted to the support structure and comprising apressure sensor operable to measure the pressure of the gas provided tothe GC module.
 21. The GC module of claim 20 wherein the circuitassembly further comprises a printed circuit board to which the pressuresensor is mounted.
 22. The GC module of claim 21, wherein the circuitassembly further comprises a detector for detecting the components ofthe gas, the detector being mounted to the printed circuit board. 23.The GC module of claim 22, wherein the separation device comprises atleast one column wound into a coil.